Liu / Luo LED Packaging for Lighting Applications

Design, Manufacturing, and Testing
1. Auflage 2011
ISBN: 978-0-470-82840-3
Verlag: John Wiley & Sons
Format: EPUB
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 376 Seiten, E-Book

Since the first light-emitting diode (LED) was invented by Holonyakand Bevacqua in 1962, LEDs have made remarkable progress in thepast few decades with the rapid development of epitaxy growth, chipdesign and manufacture, packaging structure, processes, andpackaging materials. LEDs have superior characteristics such ashigh efficiency, small size, long life, low power consumption, andhigh reliability. The market for white LED is growing rapidly invarious applications. It has been widely accepted that white LEDswill be the fourth illumination source to substitute theincandescent, fluorescent, and high-pressure sodium lamps. With thedevelopment of LED chip and packaging technologies, the efficiencyof high power white LED will broaden the application markets ofLEDs while changing the lighting concepts of our lives.
In LED Packaging for Lighting Applications, ProfessorsLiu and Luo cover the full spectrum of design, manufacturing, andtesting. Many concepts are proposed for the first time, and readerswill benefit from the concurrent engineering and co-designapproaches to advanced engineering design of LED products.
* One of the only books to cover LEDs from package design tomanufacturing to testing
* Focuses on the design of LED packaging and its applicationssuch as road lights
* Includes design methods and experiences necessary for LEDengineers, especially optical and thermal design
* Introduces novel LED packaging structures and manufacturingprocesses, such as ASLP
* Covers reliability considerations, the most challenging problemfor the LED industry
* Provides measurement and testing standards, which are criticalfor LED development, for both LED and LED fixtures
* Codes and demonstrations available from the book'sCompanion Website
This book is ideal for practicing engineers working in design orpackaging at LED companies and graduate students preparing for workin industry. This book also provides a helpful introduction foradvanced undergraduates, graduates, researchers, lightingdesigners, and product managers interested in the fundamentals ofLED design and production.
Color version of selected figures can be found atwww.wiley.com/go/liu/led

Autoren/Hrsg.

Liu, Sheng

Luo, Xiaobing

Über Autor(innen)

Sheng Liu is a ChangJiang Professor of MechanicalEngineering at Huazhong University of Science and Technology. Heholds a dual appointment at Wuhan National Laboratory forOptoelectronics, and has served as tenured faculty at Wayne StateUniversity. He has over 14 years experience in LED/MEMS/ICpackaging and extensive experience in consulting with many leadingmulti-national and Chinese companies. Liu was awarded the WhiteHouse/NSF Presidential Faculty Fellowship in 1995, ASME YoungEngineer Award in 1996, and China NSFC Overseas Young Scientist in1999. He has been an associate editor for IEEE Trans. On ElectronicPackaging Manufacturing since 1999 and an associate editor ofJournal of Frontiers of Optoelectronics in China since 2007. He iscurrently one of the 11 National Committee Members in LED underMinistry of Science and Technology. He obtained a Ph.D. fromStanford in 1992, and got MS and BS in flight vehicle design,Nanjing University of Aeronautics and Astronautics, and he hadthree years industrial experience in China and USA. He has filedmore than 70 patents in China and the USA, and has published morethan 300 technical articles.
Xiaobing Luo is a professor at Huazhong University ofScience and Technology, Wuhan, China, with appointments at theSchool of Energy and Power Engineering and Wuhan National Lab forOptoelectronics. He received his Ph.D. in 2002 from TsinghuaUniversity, China. He has also worked in Samsung Electronics inKorea as a Senior Engineer. His main research interests are LED,heat and mass transfer, microfluidics, MEMS, and sensors andactuators. He has published more than 60 papers and has applied for40 patents in the USA, Korea, Japan, Europe and China.