Buch, Englisch, 137 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 2409 g
Reihe: Mathematical Engineering
Thermal Resistance of Contact Layer
Buch, Englisch, 137 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 2409 g
Reihe: Mathematical Engineering
ISBN: 978-3-319-85153-2
Verlag: Springer International Publishing
This monograph comprehensively describes phenomena of heat flow during phase change as well as the dynamics of liquid solidification, i.e. the development of a solidified layer. The book provides the reader with basic knowledge for practical designs, as well as with equations which describe processes of energy transformation. The target audience primarily comprises researchers and experts in the field of heat flow, but the book may also be beneficial for both practicing engineers and graduate students.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Technische Thermodynamik
- Mathematik | Informatik Mathematik Numerik und Wissenschaftliches Rechnen
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Strömungslehre
- Naturwissenschaften Physik Mechanik Kontinuumsmechanik, Strömungslehre
- Naturwissenschaften Physik Physik Allgemein Theoretische Physik, Mathematische Physik, Computerphysik
Weitere Infos & Material
Introduction.- Solidification.- Solidification of PCM Materials.- The Model of Solidification of A Liquid with the Contact Layer.- Solidification on a Rectangular Geometrics.- Solidification in an Annular Space.- Solidification of a Liquid Flowing into the Channel.- The Role of the Contact Layer in a Solidification Process.- Phase Heat Accumulator.