Li / Lu / Wong Electrical Conductive Adhesives with Nanotechnologies
2010
ISBN: 978-0-387-88783-8
Verlag: Springer US
Format: PDF
Kopierschutz: 1 - PDF Watermark
E-Book, Englisch, 445 Seiten, eBook
ISBN: 978-0-387-88783-8
Verlag: Springer US
Format: PDF
Kopierschutz: 1 - PDF Watermark
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Zielgruppe
Research
Autoren/Hrsg.
Weitere Infos & Material
Nanotechnology.- Characterizations of Electrically Conductive Adhesives.- Isotropically Conductive Adhesives (ICAs).- Anisotropically Conductive Adhesives/Films (ACA/ACF).- Non-Conductive Adhesives/Films (NCA/NCF).- Conductive Nano-Inks.- Intrinsically Conducting Polymers (ICPs).- Future Trend of Conductive Adhesive Technology.
