Li / Lu / Wong Electrical Conductive Adhesives with Nanotechnologies

1. Auflage 2009
ISBN: 978-0-387-88783-8
Verlag: Springer US
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 445 Seiten, eBook

“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Zielgruppe

Research

Autoren/Hrsg.

Li, Yi (Grace)

Lu, Daniel

Wong, C.P.

Inhaltsverzeichnis

Nanotechnology.- Characterizations of Electrically Conductive Adhesives.- Isotropically Conductive Adhesives (ICAs).- Anisotropically Conductive Adhesives/Films (ACA/ACF).- Non-Conductive Adhesives/Films (NCA/NCF).- Conductive Nano-Inks.- Intrinsically Conducting Polymers (ICPs).- Future Trend of Conductive Adhesive Technology.