Lee / Tentzeris Three-Dimensional Integration and Modeling

A Revolution in RF and Wireless Packaging
1. Auflage 2022
ISBN: 978-3-031-01703-2
Verlag: Springer International Publishing
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 108 Seiten, Web PDF

Reihe: eBColl Synthesis Collection 1

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References

Zielgruppe

Professional/practitioner

Autoren/Hrsg.

Lee, Jong-Hoon

Tentzeris, Manos M.

Inhaltsverzeichnis

Introduction.- Background on Technologies for Millimeter-Wave Passive Front-Ends.- Three-Dimensional Packaging in Multilayer Organic Substrates.- Microstrip-Type Integrated Passives.- Cavity-Type Integrated Passives.- Three-Dimensional Antenna Architectures.- Fully Integrated Three-Dimensional Passive Front-Ends.- References.

Über Autor(innen)

Jong-Hoon Lee received the B.S. Degree in electrical engineering from The Pennsylvania State University, University Park, with high honor in the spring of 2001. He joined the electrical engineering at The Georgia Institute of Technology, in the fall of 2001 and received an M.S. degree in the fall of 2004 and a Ph.D. in the summer of 2007 under the advice of Prof. Manos M. Tentzeris. Dr. Lee is now the senior CAE engineer at RFMD in the design integration department. His research interests are SOP and SIP packaging technologies for microwave/mmW systems, passive/active circuits for RF/wireless systems, DSP-based predictors to improve the computational 108 THREE-DIMENSIONAL INTEGRATION efficiency of the simulation of highly resonant RF geometries. Jong-Hoon Lee also researches the development of the LTCC system-on-package (SOP) module for millimeter-wave wireless systems, FDTD/Spice interface, and active devices modeling with FDTD and MRTD. He was a member of the Georgia Tech ATHENA research group, NSF packaging research center, the Georgia Electronic Design Center, and Tau Beta Pi Honor association.