Le Tiec | Chemistry in Microelectronics | E-Book | sack.de
E-Book

E-Book, Englisch, 384 Seiten, E-Book

Le Tiec Chemistry in Microelectronics


1. Auflage 2013
ISBN: 978-1-118-57812-4
Verlag: John Wiley & Sons
Format: EPUB
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 384 Seiten, E-Book

ISBN: 978-1-118-57812-4
Verlag: John Wiley & Sons
Format: EPUB
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)



Microelectronics is a complex world where many sciences need tocollaborate to create nano-objects: we need expertise inelectronics, microelectronics, physics, optics and mechanics alsocrossing into chemistry, electrochemistry, as well as biology,biochemistry and medicine. Chemistry is involved in many fieldsfrom materials, chemicals, gases, liquids or salts, the basics ofreactions and equilibrium, to the optimized cleaning of surfacesand selective etching of specific layers. In addition, over recentdecades, the size of the transistors has been drastically reducedwhile the functionality of circuits has increased. This bookconsists of five chapters covering the chemicals and sequences usedin processing, from cleaning to etching, the role and impact oftheir purity, along with the materials used in "Front End Ofthe Line" which corresponds to the heart and performance ofindividual transistors, then moving on to the "Back End Ofthe Line" which is related to the interconnection of all thetransistors. Finally, the need for specific functionalization alsorequires key knowledge on surface treatments and chemicalmanagement to allow new applications.
Contents
1. Chemistry in the "Front End of the Line" (FEOL):Deposits, Gate Stacks, Epitaxy and Contacts, François Martin,Jean-Michel Hartmann, Véronique Carron and Yannick LeTiec.
2. Chemistry in Interconnects, Vincent Jousseaume, Paul-HenriHaumesser, Carole Pernel, Jeffery Butterbaugh, SylvainMaîtrejean and Didier Louis.
3. The Chemistry of Wet Surface Preparation: Cleaning, Etching andDrying, Yannick Le Tiec and Martin Knotter.
4. The Use and Management of Chemical Fluids in Microelectronics,Christiane Gottschalk, Kevin Mclaughlin, Julie Cren, CatherinePeyne and Patrick Valenti.
5. Surface Functionalization for Micro- and Nanosystems:Application to Biosensors, Antoine Hoang, Gilles Marchand,Guillaume Nonglaton, Isabelle Texier-Nogues and FrancoiseVinet.
About the Authors
Yannick Le Tiec is a technical expert at CEA-Leti, Minatec since2002. He is a CEA-Leti assignee at IBM, Albany (NY) to develop theadvanced 14 nm CMOS node and the FDSOI technology. He helddifferent technical positions from the advanced 300 mm SOI CMOSpilot line to different assignments within SOITEC for advancedwafer development and later within INES to optimize solar cellramp-up and yield. He has been part of the ITRS Front End technicalworking group at ITRS since 2008.

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Weitere Infos & Material


Preface ix
Chapter 1. Chemistry in the "Front End of the Line" (FEOL):Deposits, Gate Stacks, Epitaxy and Contacts 1
François MARTIN, Jean-Michel HARTMANN, VéroniqueCARRON and Yannick LE TIEC
1.1. Introduction 1
1.2. Arrangement of the gate 3
1.3. Chemistry of crystalline materials 19
1.4. Contact areas between the gate and the "source" and "drain"38
1.5. General conclusion 57
1.6. List of Abbreviations 58
1.7. Bibliography 59
Chapter 2. Chemistry in Interconnects 81
Vincent JOUSSEAUME, Paul-Henri HAUMESSER, Carole PERNEL, JefferyBUTTERBAUGH, Sylvain MAÎTREJEAN and Didier LOUIS
2.1. Introduction 81
2.2. Interconnects: generalities and background 83
2.3. Dielectric deposits 99
2.4. Deposition and properties of metal layers for interconnectstructures 122
2.5. Cleaning process for copper interconnects 144
2.6. General conclusions and perspectives 161
2.7. List of Abbreviations 164
2.8. Bibliography 165
Chapter 3. The Chemistry of Wet Surface Preparation:Cleaning, Etching and Drying 187
Yannick LE TIEC and Martin KNOTTER
3.1. Introduction 187
3.2. Cleaning 188
3.3. Wet etching 202
3.4. Rinsing and drying 214
3.5. Conclusion 224
3.6. List of Abbreviations 225
3.7. Bibliography 225
Chapter 4. The Use and Management of Chemical Fluids inMicroelectronics 233
Christiane GOTTSCHALK, Kevin MCLAUGHLIN, Julie CREN, CatherinePEYNE and Patrick VALENTI
4.1. Ultrapure water 233
4.2. Gases for semiconductors 251
4.3. Dissolved gases 268
4.4. High-purity chemicals 283
4.5. Waste management 290
4.6. List of Abbreviations 301
4.7. Bibliography 303
Chapter 5. Surface Functionalization for Micro- andNanosystems: Application to Biosensors 309
Antoine HOANG, Gilles MARCHAND, Guillaume NONGLATON, IsabelleTEXIER-NOGUES and Francoise VINET
5.1. Introduction 309
5.2. Materials 310
5.3. Functionalization process 317
5.4. Molecule and macromolecule immobilization 332
5.5. Analytes capture 340
5.6. Conclusion 348
5.7. List of Abbreviations 349
5.8. Bibliography 349
List of Authors 361
Index 363



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