Wireless Interface Technologies for 3D IC and Module Integration

Erscheinungsjahr 2021
ISBN: 978-1-108-84121-4
Verlag: Cambridge University Press

Buch, Englisch, 300 Seiten, Format (B × H): 175 mm x 250 mm, Gewicht: 760 g

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design.

Autoren/Hrsg.

Kuroda, Tadahiro

Yip, Wai-Yeung

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise

Inhaltsverzeichnis

1. Introduction – 3D integration and near-field coupling; 2. ThruChip interface – a wireless chip interface; 3. Transmission line coupler – a wireless module connector; 4. The future of computing – 3D SRAM for neural network, eBrain.

Über Autor(innen)

Kuroda, Tadahiro
Tadahiro Kuroda is Professor and Founding Director at the Systems Design Lab at the University of Tokyo. He is a Fellow of the IEICE and the IEEE.

Yip, Wai-Yeung
Wai-Yeung Yip is a Researcher at the University of Tokyo with over twenty-five years of industry experience in high-speed chip interface design.