Buch, Englisch, 88 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 1591 g
Reihe: SpringerBriefs in Electrical and Computer Engineering
Buch, Englisch, 88 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 1591 g
Reihe: SpringerBriefs in Electrical and Computer Engineering
ISBN: 978-3-319-02380-9
Verlag: Springer
This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
An introduction to high-speed DRAM.- An I/O Line Configuration and Organization of DRAM.- Clock generation and distribution.- Transceiver Design.- TSV Interface for DRAM.
