Buch, Englisch, 156 Seiten, Format (B × H): 173 mm x 246 mm, Gewicht: 508 g
Reihe: Synthesis Lectures on Engineering, Science, and Technology
Buch, Englisch, 156 Seiten, Format (B × H): 173 mm x 246 mm, Gewicht: 508 g
Reihe: Synthesis Lectures on Engineering, Science, and Technology
ISBN: 978-3-031-90838-5
Verlag: Springer
This book provides professionals in microelectronic implantable bio-medical systems an overview of recent techniques in wireless power and data telemetry. State-of-the-art techniques are overviewed and original methods presented. The book features an up-to-date overview of CMOS wireless telemetry microelectronics for cortical implants. The book gathers all layers of microelectronics wireless power and data transmission for cortical implants, discusses them in a critical manner and proposes solutions, i.e., at circuit and systems and system levels. This book compiles relevant information into a coherent presentation of the technical issues, proposed solutions and their compared efficiency, and details the authors’ original approaches. Professionals of microelectronics will find useful and accessible descriptions of the major issues and solutions to wireless telemetry. Researchers and professionals in bio-medical implantable systems will find fully justified novel methods in power and data telemetry and implantable systems telemetry architectures.
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Sonstige Technologien | Angewandte Technik Medizintechnik, Biomedizintechnik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
- Medizin | Veterinärmedizin Medizin | Public Health | Pharmazie | Zahnmedizin Medizin, Gesundheitswesen Medizintechnik, Biomedizintechnik, Medizinische Werkstoffe
- Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik
Weitere Infos & Material
Introduction.- Wirelessly Powered Biomedical Implants.- System-Level Modeling.- Implantable Dual-Band Inductive Link.- Wireless Power Conversion Chain and Control Methods.- Wireless Data Communication.- On-chip CMOS Temperature Sensing.- System-on-Chip Integration.- Conclusion.