Judd / Brindley Soldering in Electronics Assembly

1. Auflage 2013
ISBN: 978-1-4831-0217-7
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 300 Seiten, Web PDF

Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assemblies.

Keith is a freelance journalist whose whole life (well, apart from the wife, the kids, the music and the mountain bike) is computers. He's been writing about them (computers, that is) for over 18 years, in the meantime working as a teacher, lecturer, engineer, journalist and finally (for the last 12 years) freelance in the computing field. He fondly remembers his first contacts with the Commodore Pet, the various Sinclair oddities, the BBC, PC-DOS, MS-DOS, the Mac, and the various incarnations of Windows. He dreams of new software and hardware, he realises that writing about computers makes little compared to making computers or writing the software for them, he is fully committed to passing his experience along to and making computer-life easier for his readers, yet still enjoys what he's doing. Which can't be all bad!

Autoren/Hrsg.

Judd, Mike

Brindley, Keith

Inhaltsverzeichnis

1;Front Cover;1
2;Soldering in Electronics Assembly;4
3;Copyrights Page;5
4;Table of Contents;6
5;Preface;10
6;Acknowledgements;13
7;Chapter 1. Soldering process;16
7.1;Time on its side;16
7.2;Soldering;21
7.3;Soldering processes;29
7.4;Component/solder (CS) processes;31
7.5;Solder/component (SC) processes — 'reflow' soldering;32
7.6;Cleaning;33
7.7;Quality;34
7.8;Safety;34
8;Chapter 2. Electronics assemblies;36
8.1;Joints;36
8.2;Through-hole joints;39
8.3;Surface mounted components;47
8.4;Surface mounted joints;49
8.5;Assembly variations;54
8.6;Assembly classification;59
8.7;Solder paste or adhesive application;61
9;Chapter 3. Solder;72
9.1;Metallurgical properties of tin/lead alloys;72
9.2;The soldered joint;76
9.3;Solderability;87
9.4;Protective coatings;90
10;Chapter 4. Flux;98
10.1;Need for flux;98
10.2;How fluxes work;99
10.3;Categorization of fluxes;101
10.4;Choosing a flux;106
10.5;Application of fluxes;106
11;Chapter 5. CS soldering processes;116
11.1;Hand soldering;116
11.2;Mass CS soldering processes;122
11.3;Inert atmosphere soldering;123
11.4;Handling assemblies;124
11.5;Solder pots and pumps;131
11.6;Solder pot heaters;132
11.7;Soldering;134
12;Chapter 6. SC soldering processes;148
12.1;Heat application;148
12.2;Infra-red soldering;150
12.3;Preheating;153
12.4;Temperature differentials;153
12.5;Profiles;154
12.6;Hot vapour soldering;159
12.7;Laser soldering;163
12.8;Light beam soldering;167
12.9;Heated collet or hot bar;167
12.10;Miscellaneous SC soldering processes;170
12.11;Comparison of soldering processes;171
13;Chapter 7. Cleaning of soldered assemblies;172
13.1;The Montreal Protocol;172
13.2;Why clean at all?;173
13.3;Contamination;174
13.4;Classifications of cleaner;176
13.5;Cleaning processes;180
13.6;Contamination testing;188
13.7;Comparing the cleaning options;190
14;Chapter 8. Avoiding problems — soldering quality;192
14.1;Have problems occurred?;192
14.2;Statistical process control;193
14.3;Solutions to problems;195
15;Chapter 9. Standards & specifications;214
15.1;Why comply with standards;214
15.2;Reference to standards;214
15.3;Levels of standards;215
15.4;Standards organizations and bodies;215
15.5;Standards for electronics assembly manufacture;218
15.6;Guide to relevant worldwide standards;220
16;Glossary;236
17;References;248
18;Further reading;250
18.1;Specific books and articles;250
18.2;Trade publications and journals;253
19;Worldwide addresses;256
19.1;UK Governmental Departments;256
19.2;Institutions and associations;257
19.3;Standards organizations and bodies;260
19.4;Defence;263
20;Appendix 1: Why not blame the machine?;264
20.1;A guide for the misguided;264
21;Appendix 2: Problems & solutions;270
22;Appendix 3: Soldering safety;274
23;Appendix 4: Comparing soldering processes & machines;292
23.1;Wave soldering machine evaluation;294
24;Wave soldering machine evaluation;294
25;Index;297