Practical Guide for the Reliable Packaging of Electronics

Thermal and Mechanical Design and Analysis
4. Auflage 2025
ISBN: 978-1-032-88114-0
Verlag: CRC Press

Buch, Englisch, 332 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 666 g

A definitive guide for both newcomers to the field and those in need of a refresher, the fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures. This edition equips design engineers with the tools to assess their work in the early stages of development, helping them identify and address weak points before they lead to system failures.

As the demand for integrating more electronic capabilities into smaller packages continues to rise, product developers and manufacturers must carefully consider how module placement and component selection impact performance. This updated edition features expanded content, including advancements in cooling technologies and materials, guidance on vibration isolation and design challenges, deeper insights into system and subsystem reliability, robust test method development, and a newly added section on applying Six Sigma DMAIC methodology for thermal and mechanical failure analysis.

By consulting this essential resource, engineers, program managers, and quality assurance professionals involved in electromechanical systems will gain a solid foundation in electronics packaging. Readers will learn to establish design guidelines, recognize potential reliability issues, and perform more thorough analyses, ultimately leading to more reliable and efficient system designs.

Zielgruppe

Professional Practice & Development

Autoren/Hrsg.

Jamnia, Ali

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik
• Technische Wissenschaften Bauingenieurwesen Bauingenieurwesen
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau

Inhaltsverzeichnis

1. ISSUES IN ELECTRONICS PACKAGING DESIGN.  2. BASIC HEAT TRANSFER: CONDUCTION, CONVECTION AND RADIATION.  3. CONDUCTIVE COOLING. 4. RADIATION COOLING. 5. FUNDAMENTALS OF CONVECTION COOLING. 6. COMBINED MODES, TRANSIENT HEAT TRANSFER AND ADVANCED MATERIALS. 7. BASICS OF VIBRATION AND ITS ISOLATION. 8. BASICS OF SHOCK MANAGEMENT. 9. INDUCED STRESSE. 10. ERROR PROOFING MEASUREMENTS. 11. MECHANICAL AND THERMOMECHANICAL CONCERNS.12. ACOUSTICS. 13. MECHANICAL FAILURES AND RELIABILITY. 14. ELECTRICAL FAILURES AND RELIABILITY. 15. CHEMICAL ATTACK FAILURES AND RELIABILITY. 16. RELIABILITY MODELS, PREDICTIONS AND CALCULATIONS. 17. DESIGN CONSIDERATIONS IN AN AVIONICS ELECTRONIC PACKAGE

Über Autor(innen)

Dr. Jamnia has published four books with CRC Press, a large number of engineering papers and presentations as well as non-technical articles along with a number of patents. He has a demonstrated basic understanding of the engineering principles particularly in the areas of fluid flow, heat transfer and stress analysis. His primary expertise lies in electromechanical systems design and analysis particularly using numerical approximations and computer simulation. Currently, he heads design for reliability, compliance and safety activities for a medical device company.

His focus on the issues of electronics packaging began in the early 90s. And since 1995, he has been involved with the design and development of innovative electronics system particularly in the medical field. His prime achievement was the development of a specialized computer systems called the Learning Stationä to be used as teaching tool for individuals with cognitive delays and/or physical disabilities.

Dr. Jamnia enjoys teaching and interacting with others. In fact, Society for Automotive Engineers (SAE) had sponsored him for nearly ten years to teach workshops on electronics packaging form a thermal and mechanical design and analysis point of view.