Substrate Noise Coupling in RFICs

1. Auflage. Softcover version of original hardcover Auflage 2008
ISBN: 978-90-481-7789-9
Verlag: Springer Netherlands

Buch, Englisch, 119 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 219 g

Reihe: Analog Circuits and Signal Processing

The book reports modeling and simulation techniques for substrate noise coupling effects in RFICs and introduces isolation structures and design guides to mitigate such effects with the ultimate goal of enhancing the yield of RF and mixed signal SoCs. The book further reports silicon measurements, and new test and noise isolation structures. To the authors’ knowledge, this is the first title devoted to the topic of substrate noise coupling in RFICs as part of a large SoC.

Zielgruppe

Research

Autoren/Hrsg.

Ismail, Mohammed

Helmy, Ahmed

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik Fernmeldetechnik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise

Inhaltsverzeichnis

Analysis of Substrate Noise Coupling.- Experimental Data to Calibrate the Design Flow.- Design Guide for Substrate Noise Isolation in RF Applications.- On Chip Inductors Design Flow.- Case Studies for the Impacts and Remedies of Substrate Noise Coupling.- Conclusion and Future Work.

Über Autor(innen)

Mohammed Ismail is the Springer Series Advisor for the Analog Circuits and Signal Processing book series