Buch, Englisch, Band 508, 233 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 382 g
Reihe: IFIP Advances in Information and Communication Technology
VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability
Softcover Nachdruck of the original 1. Auflage 2017
ISBN: 978-3-319-88379-3
Verlag: Springer International Publishing
24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers
Buch, Englisch, Band 508, 233 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 382 g
Reihe: IFIP Advances in Information and Communication Technology
ISBN: 978-3-319-88379-3
Verlag: Springer International Publishing
This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016. The 11 papers included in the book were carefully reviewed and selected from the 36 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Mathematik | Informatik EDV | Informatik Technische Informatik Hardware: Grundlagen und Allgemeines
- Mathematik | Informatik EDV | Informatik Computerkommunikation & -vernetzung
- Mathematik | Informatik EDV | Informatik Professionelle Anwendung Computer-Aided Design (CAD)
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise