Buch, Englisch, 319 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 6565 g
Reihe: The Frontiers Collection
New Vistas in Nanoelectronics
Buch, Englisch, 319 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 6565 g
Reihe: The Frontiers Collection
ISBN: 978-3-319-22092-5
Verlag: Springer International Publishing
The release of this second volume of CHIPS 2020 coincides with the 50th anniversary of Moore’s Law, a critical year marked by the end of the nanometer roadmap and by a significantly reduced annual rise in chip performance. At the same time, we are witnessing a data explosion in the Internet, which is consuming 40% more electrical power every year, leading to fears of a major blackout of the Internet by 2020.
The messages of the first CHIPS 2020, published in 2012, concerned the realization of quantum steps for improving the energy efficiency of all chip functions. With this second volume, we review these messages and amplify upon the most promising directions: ultra-low-voltage electronics, nanoscale monolithic 3D integration, relevant-data, brain- and human-vision-inspired processing, and energy harvesting for chip autonomy. The team of authors, enlarged by more world leaders in low-power, monolithic 3D, video, and Silicon brains, presents new vistas in nanoelectronics, promising Moore-like exponential growth sustainable through to the 2030s.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Biomaterialien, Nanomaterialien, Kohlenstoff
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
- Technische Wissenschaften Technik Allgemein Nanotechnologie
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
Weitere Infos & Material
News on 8 Chip-Technologies.- Monolithic 3D Integration.- Comprehensive, Reliable, Low-Power Electronics.- Analog for a Digital World.- Interconnects, Communication.- Developments in the Chip Market.- ITRS, The 2014-2029 International Technology Roadmap of Semiconductors.- Nanolithography.- Power-Efficient Design.- Super processors and Super computers.- Memory.- Hybrid 3D Integration for Wireless Multimedia.- Technology for the Next-Generation Mobile User.- MEMS –Micro-Electromechanical Systems.- Vision Chips and Cameras.- Digital Neural Networks.- Retinal Implants.- The Human-Brain Projects.- Energy Harvesting and Chip Autonomy.- 2020 World with Chips.
