Heyns / Meuris / Mertens Ultra Clean Processing of Silicon Surfaces V

Erscheinungsjahr 2001
ISBN: 978-3-0357-0700-7
Verlag: Trans Tech Publications
Format: PDF
Kopierschutz: 0 - No protection

E-Book, Englisch, 340 Seiten

Volume is indexed by Thomson Reuters CPCI-S (WoS).The proceedings of the Fifth International Symposium on Ultra Clean Processing of Silicon Surfaces cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).

Autoren/Hrsg.

Heyns, Marc

Meuris, Marc

Mertens, Paul

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde

Inhaltsverzeichnis

Preface, Conference Organisation and Sponsors
Defects and Contamination in Microelectronic Device Production: State-of-the-Art and Prospects
The Effect of Ion Implantation on the Metal Contamination of Silicon Surfaces in Aqueous Solution
Barium, Strontium and Bismuth Contamination in CMOS Processes
An Exploration on the Bridge Formation Mechanism of Cylindrical Storage Poly-Silicon by Water Marks in High Performance 4Gigabit DRAM Capacitor
Chemical Processing and Materials Compatibility of High-K Dielectric Materials for Advanced Gate Stacks
Wettability Modification of Polysilicon for Stiction Reduction in Silicon Based Micro-electromechanical Structures
Dual Gate Oxide for 0.18µm Technologies and Below: Optimization of the Wet Processing Sequence
New Aqueous Clean for Aluminum Interconnects: Part I. Fundamentals
Metal Wet Cleaning with No Corrosion: A Novel Approach
Non-Contact Post Cu CMP Cleaning Using Megasonic Energy
Improved Phosphoric Acid Mixtures for Nitride Strip
Silicon Wafer Cleaning Processes Monitoring by the Surface Charge Profiler Method
New Aqueous Clean for Aluminum Interconnects: Part II. Applications
Synchronous Schlieren Image Analysis of Megasonic Single Wafer Cleaning
Dry Cleaning of Organic Contamination on Silicon Wafers Using Rapid Optical Surface Treatment
Materials Compatibility and Organic Build-Up during Ozone-Based Cleaning of Semiconductor Devices
Surface Characterization after Different Wet Chemical Cleans
A Hydrogenated Water Application to Semiconductor Manufacturing
Investigation of Trace Metals Analyses of Dry Residue on Silicon Wafer Surfaces by TXRF and ICP-MS
Electrochemical Study for the Characterization of Wet Silicon Oxide Surfaces
Pre-Diffusion Cleaning Using Ozone and HF
Novel Back Sid