E-Book, Englisch, 316 Seiten
E-Book, Englisch, 316 Seiten
ISBN: 978-3-0357-0683-3
Verlag: Trans Tech Publications
Format: PDF
Kopierschutz: 0 - No protection
Autoren/Hrsg.
Weitere Infos & Material
Preface and Committees
The Rinsing Problem: Effect of Solute-Surface Interactions on Wafer Purity
Hydrogenated Ultrapure Water Production System for Future Wet Cleaning Process
Behaviour of Metallic Contaminants during Mos Processing
Hydrogen Peroxide Decomposition in Ammonia Solutions
New Aspects of the Diluted Dynamic Clean Process
Single Step Alkaline Cleaning Solution for Advanced Semiconductor Cleaning
Particle Removal Efficiency and Silicon Roughness in HF-DIW/O3/Megasonics Cleaning
Industrial Trends in Wet Processing Technology
Particle Addition Behaviour of Oxide Stripping by HF Solutions
The Electrochemical Kinetics of Silicon Surface Corrosion in HF Containing Dilute Solutions
Influence of the Dissolved Gas in Cleaning Solution on Silicon Wafer Cleaning Efficiency
Optimization of Deionized Water Consumption in Wafer Wet Processing
Chemistry of the Silicon Oxide Surface: Adsorption from SC1 Solutions
Production of High Concentrations of Bubble-Free Dissolved Ozone in Water
Si-Purifier: A Point of Use Purifier for Noble Metals in HF Baths
Potassium Adhesion to Various CVD Oxide and the Surface Cleaning with Hot UPW
Production Performance of Single Tank Cleaning Processes for 0,25 µm Technology
Ozonated DI-Water for Clean Chemical Oxide Growth
Ultra-Thin Oxide Growth on Silicon Using Ozonated Solutions
Gas-Phase Surface Processing Prior to 3.2 nm Gate Oxidation
Post Dry-Etch Cleaning Issues of an Organic Low-K Dielectric
Vapor Phase Decomposition - Droplet Collection: Can we Improve the Collection Efficiency for Copper Contamination?
Characterization of the Post Dry Etch Cleaning of the Silicon Surface Prior to Silicon Epitaxial Growth
Silicon Contamination Prevention in HF Mixtures
Applications of Tetramethylammoninium Hydroxide (TMAH) as a Post Tungsten CMP Cleaning Mixture
Fe and Cu Removal Efficiency in HF-DIW/O3 Cleaning Sequence
Post Polysilicon Etch (Incorporating DUV Resist an BARC) Polymer Cleaning
Determination of Moisture / Water in Semiconductor Processing Liquids On-Line with the SemiChem Process Analyzer
Evaluation of Cleaning Recipes Based on Ozonated Water for Pre-Gate Oxide Cleaning
Characterization of Emitter Interface Oxide Growth in a Vertical LPCVD Polysilicon Deposition Reactor
Nitride Strip: Phosphoric Acid Bath-Life above 100 Hours
Wet Metal Etching for Ti/Co Self-Aligned Silicides
Post-Titanium-Salicide Cleaning with Spray Technology
XPS Study of the Cleaning Efficiency by Ozone Processes of the Protective Films Formed by Reactive Ion Etching of Co and Ti Silicide
Plasma Etch Residue and Photoresist Removal Utilizing Environmentally Benign Process Chemicals
Angle Resolved XPS Characterization of the Formation of Cl and Br Bonds in Poly-Silicon Etching and Its Cleaning
Dynamics of Mass Transfer on a Wafer Surface in Ozonated-Water Processing for Photoresist Removal
Construction of the Distribution System for Ozonized Water Used in the Wet Cleaning of Si Wafer Surface
A Novel Resist and Post-Etch Residue Removal Process Using Ozonated Chemistry
Post CMP Cleaning Using a Novel HF Compatible High Power Magasonic Tank
Relation between Oxide-CMP Induced Defects and Post-CMP Cleaning Strategies
Evaluation of Post Metal Etch Cleaning by Analyzing the Chemical Compositions and Distributions on the Etched Al Surface
New Methods for Contamination Control and Dry Cleaning of Silicon Wafers
Wafer Backside Cleaning by Twin-Fluid Flow Cleaning
Evaluation of a Dry Laser Cleaning Process for the Removal of Surface Particles
Dependency of Micro Particle Adhesion of Dispersive and Nondispersive Interactions Analyzed by Atomic Force Microscopy
Integrated Cleaning: Application of Densified Fluid Cleaning (DFC) to Post-Etch Residue Removal
Application of Microcalorimeter EDS X-Ray Detectors to Particle Analysis
Surface Characterization in the Silicon Cleaning Process by a-UPC; Atmospheric Ultraviolet Photoelectron Counting
Microscopic Analysis of Particle Removal by Gas/Liquid Mixture High-Speed Flow
Kelvin-SPV Measurements of Atomically-Flat Si(111) Surfaces Contaminated with Metallic Ions
Comparison of Analytical Methods for Residue Detection of Resist Removal Processes
Dry Cleaning Technologies Using UV-Excited Radicals and Cryogenic Aerosols
A New HF Vapor Process for Native Oxide Removal, Suited for Cluster Applications
Silicon Surface Cleaning for Low Temperature Silicon Epitaxial Growth
Role of UV/Chlorine Exposure during Dry Surface Conditioning before Integrated Epi Deposition Process
Electrical Evaluation of the Epi/Substrate Interface Quality after Different In-Situ and Ex-Situ Low-Temperature Pre-Epi Cleaning Methods
Energy Loss of O1s Photoelectrons in Compositional and Structural Transition Layer at and near the SiO2/Si Interface
Metal Enhanced Oxidation of Silicon
Effect of Si Surface Roughness on the Current-Voltage Characteristics of Ultra-Thin Gate Oxides
Infrared Absorption Studies of Wet Chemical Oxides: Thermal Evolution of Impurities
X-Ray Photoelectron Study of Gate Oxides and Nitrides
Evaluation of C3F8 as an In-Situ Cleaning Gas for PECVD Tools
Generation at Point-of-Use of BHF
Characterization of HF Cleaning of Ion-Implanted Si Surfaces
Determination of SC1 Etch Rates at Low Temperatures with Microscope Interferometry
Impact of Trace Metals in Litho Chemicals
Post Metal Etch Polymer Removal: An Investigation of Parameters that Influence Corrosion
A Process Using Ozonated Water Solutions to Remove Photoresist after Metallization
The Optimization of the Cleaning to Remove Residual Bonds of Si-C and Si-F after Fluorocarbon Plasma Etch on the Silicon Surface
