Electronic Materials and Processes Handbook

2. Auflage 1993
ISBN: 978-0-07-054299-0
Verlag: McGraw-Hill Education

Buch, Englisch, Format (B × H): 160 mm x 236 mm, Gewicht: 1070 g

Autoren/Hrsg.

Harper, Charles

Sampson, Ronald

Inhaltsverzeichnis

Plastics, Elastomers, and Processing.Printed Wiring Boards.Ceramics and Glasses.Semiconductors, Ferrous and Non-Ferrous Metals.Wire and Cable.Metal Joining of Electronic Circuits.Thick and Thin Films.Electrodeposition Materials and Processes.Lithography and Photofabrication.Materials and Processes for Advanced Packaging.

Über Autor(innen)

Harper, Charles
Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering, Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.