Buch, Englisch, 352 Seiten, Format (B × H): 156 mm x 234 mm, Gewicht: 810 g
Buch, Englisch, 352 Seiten, Format (B × H): 156 mm x 234 mm, Gewicht: 810 g
ISBN: 978-1-032-01429-6
Verlag: Taylor & Francis
This book covers theoretical and practical aspects of all major steps in the fabrication sequence. This book can be used conveniently in a semester length course on integrated circuit fabrication. This text can also serve as a reference for practicing engineer and scientist in the semiconductor industry. IC Fabrication are ever demanding of technology in rapidly growing industry growth opportunities are numerous. A recent survey shows that integrated circuit currently outnumber humans in UK, USA, India and China. The spectacular advances in the development and application of integrated circuit technology have led to the emergence of microelectronic process engineering as an independent discipline. Integrated circuit fabrication text books typically divide the fabrication sequence into a number of unit processes that are repeated to form the integrated circuit. The effect is to give the book an analysis flavor: a number of loosely related topics each with its own background material.
Note: T& F does not sell or distribute the Hardback in India, Pakistan, Nepal, Bhutan, Bangladesh and Sri Lanka.
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikrowellentechnik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
- Technische Wissenschaften Energietechnik | Elektrotechnik Elektrotechnik
Weitere Infos & Material
1. Introduction to Silicon Wafer Processing 2. Epitaxy 3. Oxidation 4. Lithography 5. Etching 6. Diffusion 7. Ion Implantation 8. Film Deposition: Dielectric, Polysilicon and Metallization 9. Packaging 10. VLSI Process Integration
