Ganesan / Pecht Lead-free Electronics

1. Auflage 2006
ISBN: 978-0-470-00779-2
Verlag: John Wiley & Sons
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 794 Seiten, E-Book

Lead-free Electronics provides guidance on the design and use oflead-free electronics as well as technical and legislativeperspectives. All the complex challenges confronting theelec-tronics industry are skillfully addressed:
* Complying with state legislation
* Implementing the transition to lead-free electronics, includinganticipating associated costs and potential supply chainissues
* Understanding intellectual property issues in lead-free alloysand their applications, including licensing and infringement
* Implementing cost effective manufacturing and testing
* Reducing risks due to tin whiskers
* Finding lead-free solutions in harsh environments such as in theautomotive and telecommunications industries
* Understanding the capabilities and limitations of conductiveadhesives in lead-free interconnects
* Devising solutions for lead-free, flip-chip interconnects inhigh-performance integrated circuit products
Each chapter is written by leading experts in the field andcarefully edited to ensure a consistent approach. Readers will findall the latest information, including the most recent data oncyclic thermomechanical deformation properties of lead-free SnAgCualloys and a comparison of the properties of standard Sn-Pb versuslead-free alloys, using the energy partitioning approach.
With legislative and market pressure to eliminate the use of leadin electronics manufacturing, this timely publication is essentialreading for all engineers and professionals in the electronicsindustry.

Autoren/Hrsg.

Ganesan, Sanka

Pecht, Michael G.

Inhaltsverzeichnis

Preface.
Editors.
Contributors.
Acknowledgements.
Chapter 1. Lead-Free Electronics: Overview.
Chapter 2. Lead-Free Legislations, Exemptions &Compliance.
Chapter 3. Lead-Free Alloys: Overview.
Chapter 4. Lead-Free Manufacturing.
Chapter 5. Review of Lead-Free Solder Joint Reliability.
Chapter 6. Constitutive Properties and Durability of SelectedLead-Free Solders.
Chapter 7. Interfacial Reactions and Performance of Lead-FreeSolder Joints.
Chapter 8. Conductive Adhesives.
Chapter 9. Component-Level Issues in Lead-Free Electronics.
Chapter 10. Tin Whiskers in Electronics.
Chapter 11. Lead-Free Separable Contacts and Connectors.
Chapter 12 Intellectural Property.
Chapter 13. Costs to Lead-Free Migration.
Chapter 14. Lead-Free Technologies in the Japanese ElectronicsIndustry.
Chapter 15. Guidelines for Implementing Lead-FreeElectronics.
Index.

Über Autor(innen)

SANKA GANESAN, PHD, is Associate Research Scientist at theCALCE Electronic Products System Center, University ofMaryland. His research interests include advanced materialsand interfaces in electronics packages, sensors and MEMS, lead-freeelectronics, low temperature electronics, and intermittent failuresin electronics systems. He has co-authored numerouspublications in leading journals and conference proceedings.
MICHAEL PECHT, PhD, is Chair Professor, Director, and thefounder of the CALCE Electronic Products and Systems Center,University of Maryland. Dr. Pecht is currently Chief Editor ofMicroelectronics Reliability and has written sixteen books onelectronic products development. He has consulted for over fiftymajor international electronics companies, providing expertise instrategic planning, design, test, IP, and risk assessment ofelectronic products and systems.