Fowler Developing and Managing Embedded Systems and Products

Methods, Techniques, Tools, Processes, and Teamwork
1. Auflage 2014
ISBN: 978-0-12-405863-7
Verlag: Elsevier Science & Techn.
Format: EPUB
Kopierschutz: 6 - ePub Watermark

E-Book, Englisch, 862 Seiten

This Expert Guide gives you the knowledge, methods and techniques to develop and manage embedded systems successfully. It shows that teamwork, development procedures, and program management require unique and wide ranging skills to develop a system, skills that most people can attain with persistence and effort. With this book you will: - Understand the various business aspects of a project from budgets and schedules through contracts and market studies - Understand the place and timing for simulations, bench tests, and prototypes, and understand the differences between various formal methods such as FMECA, FTA, ETA, reliability, hazard analysis, and risk analysis - Learn general design concerns such as the user interface, interfaces and partitioning, DFM, DFA, DFT, tradeoffs such as hardware versus software, buy versus build, processor choices, and algorithm choices, acquisition concerns, and interactions and comparisons between electronics, functions, software, mechanics, materials, security, maintenance, and support - Covers the life cycle for developing an embedded system: program management, procedures for design and development, manufacturing, maintenance, logistics, and legal issues - Includes proven and practical techniques and advice on tackling critical issues reflecting the authors' expertise developed from years of experience

Autoren/Hrsg.

Fowler, Kim

Inhaltsverzeichnis

1;Front Cover;1
2;Developing and Managing Embedded Systems and Products;4
3;Copyright Page;5
4;Contents;6
5;List of Contributors;24
6;About the Editor;26
7;Co-Author Biography;27
8;Author’s Biographies;28
8.1;Chapter Authors;28
8.2;Case Study Authors;30
9;Developing and Managing Embedded Systems and Products: The Roadmap;34
9.1;Chapter 1: Introduction to Good Development;34
9.2;Chapter 2: Drivers of Success in Engineering Teams;34
9.3;Chapter 3: Project Introduction;35
9.4;Chapter 4: Dealing with Risk;36
9.5;Chapter 5: Documentation;36
9.6;Chapter 6: System Requirements;36
9.7;Chapter 7: Analyses and Tradeoffs;37
9.8;Chapter 8: The Discipline of System Design;37
9.9;Chapter 9: Mechanical Design;37
9.10;Chapter 10: Electronic Design;37
9.11;Chapter 11: Software Design and Development;38
9.12;Chapter 12: Security;38
9.13;Chapter 13: Review;38
9.14;Chapter 14: Test and Integration;39
9.15;Chapter 15: Manufacturing;39
9.16;Chapter 16: Logistics, Distribution, and Support;39
9.17;Chapter 17: Agreements, Contracts, and Negotiations;40
9.18;Chapter 18: Dealing with the Government;40
9.19;Chapter 19: Agency and Getting Paid;40
9.20;Chapter 20: Intellectual Property etc.;40
9.21;Chapter 21: Open Source Software;41
9.22;Chapter 22: Laws That Can Nail Embedded Engineers;41
9.23;Chapter 23: Corporate Operations, Export, and Compliance;41
9.24;Chapter 24: Case Studies;41
10;List of Acronyms;43
11;1 Introduction to Good Development;48
11.1;About this book;49
11.1.1;Purpose;49
11.1.2;Audience;50
11.1.3;Road map;51
11.1.4;What you can get from this book;51
11.1.5;What you won’t get from this book;54
11.1.6;Definitions and some basic concepts;54
11.2;Focus;55
11.2.1;Five guiding principles;56
11.2.1.1;No silver bullets;56
11.2.1.2;Feedback stabilizes;56
11.2.1.3;Interfaces are important;56
11.2.1.4;All problems have a human origin;57
11.2.1.5;Good development and engineering require good relationships;57
11.2.2;Reliability, fault avoidance and tolerance, and error recovery;57
11.2.3;The business case;58
11.2.4;Life cycle;58
11.2.5;Types of markets and development;59
11.2.6;Recent research;59
11.3;Team attributes;59
11.3.1;Working together;59
11.3.1.1;Individual assignments;60
11.3.1.2;Relating together;61
11.3.1.3;Attributes of a good manager;62
11.3.1.4;Attributes of good technical and support staff;62
11.3.1.5;TLC’ed;63
11.3.2;Ethics;63
11.3.3;Success and failure;63
11.4;Systems engineering;65
11.4.1;INCOSE Systems Engineering Handbook;68
11.4.2;NDIA and SEI report;69
11.4.3;NASA report on cost escalation;69
11.4.4;NASA Systems Engineering Handbook;69
11.5;Various approaches to development processes;70
11.5.1;Process models for development;70
11.5.2;V-Model;70
11.5.3;Spiral model;71
11.5.4;Prototyping model;73
11.5.5;PERRU;73
11.5.6;Quality Assurance (QA);73
11.5.6.1;ISO 9001;74
11.5.6.2;Six Sigma;76
11.5.6.3;Capability Maturity Model Integration (CMMI);76
11.5.6.4;Comparison between ISO 9001 and CMMI;77
11.6;Life cycle phases;79
11.6.1;Concept;79
11.6.2;Preliminary;79
11.6.3;Critical;79
11.6.4;Test and integration;79
11.6.5;Compliance and system acceptance;80
11.6.6;Production;80
11.6.7;Shipping and delivery;80
11.6.8;Operations and support;80
11.6.9;Disposal;80
11.7;Case Study: Disastrous engineering processes fixed;80
11.7.1;The good;82
11.7.2;The bad;82
11.7.3;The ugly;82
11.7.4;The turn around;83
11.7.4.1;Trials and tribulations;83
11.7.4.2;The final product;84
11.8;Conclusion;84
11.9;Acknowledgments;84
11.10;References;84
11.11;Suggested reading;85
12;2 Drivers of Success in Engineering Teams;86
12.1;Overview of organizational and psychological drivers;87
12.1.1;Take a panoramic view of your workplace;87
12.1.2;Step on the three-legged stool;88
12.2;The role of the team member;88
12.2.1;Expectations of team members;88
12.2.1.1;Team player redefined;88
12.2.1.2;Some common expectations;89
12.2.2;Characteristics of high performers;90
12.2.3;Managing priorities;91
12.2.4;Learning with agility;91
12.3;The role of the team leader;92
12.3.1;The team leader’s role in managing change;92
12.3.1.1;Responses to change in the workplace;93
12.3.1.2;Change and loss;94
12.3.1.3;Individual patterns of response;96
12.3.1.4;Change and future focus;97
12.3.2;Aligning yourself with organizational goals and strategy;98
12.3.2.1;Organizational mission and priorities;98
12.4;Self-awareness and assessment;99
12.4.1;Leader self-awareness and style;99
12.4.1.1;The power of personality;100
12.4.1.2;Leader style;100
12.4.1.3;The 360° perspective—soliciting feedback;101
12.4.1.4;Blind spots;101
12.5;Establishing essential relationships;101
12.5.1;Identifying your stakeholders;101
12.5.2;Relationship building;102
12.5.2.1;Functional and project manager tension;102
12.6;Team development;102
12.6.1;Building blocks for team development;102
12.6.1.1;Critical team member needs;103
12.6.1.2;Diversity and inclusion;104
12.6.2;Phases of group development;104
12.7;Engagement and the motivational environment;105
12.7.1;What is engagement?;105
12.7.2;What contributes to engagement?;106
12.7.3;Motivational elements;106
12.7.3.1;Value and recognition;106
12.7.3.2;Clear expectations;107
12.7.3.3;Development;107
12.7.4;Team engagement;108
12.8;The power of dialogue;108
12.8.1;Challenging conversations;108
12.9;Enhancing success with emotional intelligence;110
12.9.1;What is emotional intelligence?;110
12.9.2;Elements of emotional intelligence;111
12.10;Handling conflict;112
12.10.1;Group conflict;113
12.10.2;Interpersonal conflict;114
12.11;Further development;115
12.12;References;115
13;3 Project Introduction;118
13.1;Overview;119
13.2;Establishing the vision, mission, goals, and objectives;119
13.2.1;The lineage and the progression;119
13.2.2;Vision—where you are heading;120
13.2.3;Mission—your fundamental purpose;121
13.2.4;Goals—measurable components;122
13.2.5;Objectives—action steps to meet goals;123
13.3;Establish the team;123
13.3.1;Define the roles;124
13.3.1.1;Project sponsor;124
13.3.1.2;Project manager;124
13.3.1.3;Project team members;125
13.3.1.4;Assemble a core project team;125
13.3.1.5;Communication is key to the team;125
13.4;Communications;125
13.4.1;Forms of communication;126
13.4.2;Stakeholders;126
13.4.3;Communication plan;126
13.4.4;Social contracts;126
13.5;Business case;128
13.5.1;Understand the market;129
13.5.2;Understand the customer;130
13.5.3;Business plan;131
13.6;Business administration and concerns;132
13.6.1;Scheduling and budgeting;132
13.6.2;Estimating accurately;132
13.6.3;A word of warning;134
13.7;Effort to introduce a project;134
13.8;Acknowledgement;134
13.9;Recommended reading;134
13.10;References;134
14;4 Dealing with Risk;136
14.1;Overview;137
14.1.1;Who performs risk management?;138
14.1.2;When is risk management done?;139
14.1.3;How is risk management done? And why?;139
14.1.4;Hazard analysis within risk management;139
14.2;Definitions;140
14.3;Risk analysis and management;141
14.3.1;Margin analysis and management;141
14.4;Hazard analysis;149
14.4.1;Criticisms of probabilistic risk assessment;150
14.5;Types of problems;152
14.6;Failure;152
14.6.1;Technical failure;152
14.6.2;Professional failure;154
14.6.3;Production failure;155
14.6.4;Commercial and marketing failure;155
14.6.5;Failure from societal change;155
14.6.6;Steps that you can take;155
14.7;Disasters and catastrophes;156
14.8;Intrusion, sabotage, theft, and destruction;157
14.9;Contingency planning;157
14.9.1;Configuration management;157
14.9.2;Assess impact and priorities;158
14.9.3;Recovery;158
14.9.4;If recovery is not possible;159
14.9.4.1;Outsourcing;159
14.9.4.2;Change course;159
14.9.4.3;Sell or merge;159
14.9.4.4;Bankruptcy;159
14.10;Effort to manage risk;159
14.11;Acknowledgement;160
14.12;References;160
15;5 Documentation;162
15.1;Overview and rationale;162
15.2;Function;163
15.3;Types and content;165
15.4;When, who, and what;165
15.5;Document formats;169
15.6;Document contents;171
15.6.1;Project plan outline;171
15.6.2;Design plan outline;172
15.6.3;Requirements’ examples;173
15.6.4;Outlines of design descriptions with examples;175
15.6.4.1;Operations, data flow, and software design description;176
15.6.4.2;Electrical and electronic design description;176
15.6.4.3;Mechanical and materials design description;177
15.6.5;Test plan example outline;178
15.6.6;Examples of test procedures;179
15.6.7;User’s manual example outline;179
15.7;Summary and parting thoughts;179
15.8;Recommended reading;180
15.9;References;180
15.10;Appendix A: Examples from a test plan;180
15.10.1;Development tests to verify design and development;180
15.10.1.1;Electrical and electronic test procedures;180
15.10.1.2;Software test procedures;181
15.10.1.3;Mechanical–structural test procedures;182
15.10.1.4;Mechanical—mechatronic test procedures;183
15.10.1.5;Optical test procedures;184
15.10.1.6;Support equipment test procedures;184
15.11;Integration test procedures;186
15.11.1;Functional integration procedures;186
15.11.2;Engineering model testbed integration procedures;187
15.11.3;System integration procedures;188
15.11.4;Environmental test procedures;188
15.12;Some test plans have a manufacturing section—here is an example;188
15.13;Acceptance test procedures;189
15.14;Installation test procedures;189
15.15;Appendix B: Examples of test procedures;190
15.15.1;Introduction;190
15.16;Mechanical, packaging, and cabling test scripts;190
15.16.1;Size, volume, and weight;190
15.16.2;Connector policies;191
15.16.3;Cabling policies;193
15.16.4;Shielding;194
15.17;Software processes test scripts;199
15.17.1;Development processes;199
15.17.2;Development metrics and rates;200
15.17.3;Error rates and defect records;201
15.18;Hardware test scripts;201
15.18.1;Performance;201
15.18.2;Memory size;202
15.18.3;Download and test ports;203
15.18.4;Power;204
16;6 System Requirements;206
16.1;Definitions;206
16.2;Developing and managing requirements;207
16.3;Customer interpretation of requirements;209
16.4;Requirement categories;209
16.4.1;Functional versus nonfunctional requirements;209
16.4.2;System architecture requirements;212
16.4.3;Requirements’ attributes;213
16.5;Common risks in setting requirements;214
16.6;Process and QA;214
16.7;Domains and properties;215
16.8;Setting boundaries;216
16.9;Framing the system for requirements definition;217
16.9.1;Information problems;217
16.9.2;Control problems;220
16.9.3;Transformation systems;221
16.9.4;Workpiece;222
16.9.5;Connection;222
16.10;Use cases;222
16.11;Prioritizing requirements;228
16.12;Recommendations to reduce requirements’ risks;230
16.13;Mike Gard: thoughts on developing requirements;232
16.14;Oshana’s Maxim—estimating requirements’ efforts;234
16.15;Acknowledgments;234
16.16;References;235
16.17;Recommended reading;235
17;7 Analyses and Tradeoffs;236
17.1;Introduction;237
17.1.1;Why analysis?;237
17.1.2;When to analyze?;238
17.1.3;How is analysis used?;238
17.1.4;Where are analyses performed?;239
17.1.5;Who analyzes?;239
17.1.6;Risk management;239
17.2;The business case;239
17.2.1;Time and money;240
17.2.2;NRE and COGS;240
17.3;Tradeoffs;242
17.3.1;Design tradeoffs;243
17.3.2;Control: Software versus electronic versus mechanical;246
17.3.3;Number of features;247
17.3.4;Buy versus build;248
17.3.5;Dependability—reliability versus fault tolerance versus availability;248
17.3.6;Explicit versus implicit;250
17.3.7;Manufacturing tradeoffs;250
17.3.8;Logistics and support tradeoffs;251
17.4;Use cases;251
17.5;Design analyses;253
17.6;Physical forms of analysis;253
17.6.1;Simulations;253
17.6.2;Bench (or laboratory) tests;255
17.6.3;Prototypes;255
17.7;Formal analysis techniques;255
17.7.1;Types and when used;255
17.7.2;Proactive analyses;256
17.7.2.1;Failure modes effects criticality analysis;256
17.7.2.2;Fault tree analysis;259
17.7.2.3;Event tree analysis;263
17.7.2.4;Dependability;266
17.7.2.5;System theoretic process analysis;266
17.7.2.6;Safety cases;271
17.7.2.7;Comparison between analyses;272
17.7.3;Further analyses for specific applications;275
17.7.3.1;Sneak circuit analysis;275
17.7.3.2;Petri net analysis;276
17.7.3.3;Barrier analysis;276
17.7.3.4;Bent pin analysis;277
17.7.3.5;Markov analysis;277
17.8;Root cause analysis (RCA);277
17.8.1;RCA find;278
17.8.2;RCA fix;279
17.8.3;RCA change;279
17.9;Final case study;279
17.10;Acknowledgment;280
17.11;References;280
17.12;Recommended reading;281
18;8 The Discipline of System Design;282
18.1;What to expect in this chapter;284
18.2;Basic definitions;285
18.2.1;What is a system?;285
18.2.2;What is system design?;285
18.2.3;How does system design fit into a project?;286
18.2.4;Who should do the system design?;287
18.2.4.1;Project manager;287
18.2.4.2;Committee;287
18.2.4.3;Systems engineer;290
18.3;Human elements in system design;291
18.3.1;The systems designer’s skill set;291
18.3.2;Language differences;292
18.3.3;System design flow steps;294
18.4;Business concerns;294
18.4.1;The cost of money;295
18.4.2;The cost of time;296
18.4.3;The cost of opportunity;296
18.4.4;NRE, tooling, and COGS costs;297
18.4.5;Overhead;300
18.4.6;Human factors;300
18.5;The art of system design;301
18.5.1;Understand system purpose and requirements;301
18.5.1.1;Business as a foreign language;302
18.5.1.2;Prepare use cases;303
18.5.1.3;The importance of early prototypes;305
18.5.1.4;The importance of frequent prototypes;308
18.5.2;Analyze requirements for feasibility and cost;309
18.5.3;Partition system design into modules;310
18.5.4;Requirements budgeting;312
18.5.5;Elaborating and tracking requirements;314
18.5.6;Design for this and that;315
18.5.6.1;Design for life cycle;315
18.5.6.2;Design for production volume;316
18.5.6.3;Design for maintenance;316
18.5.6.4;Design for upgrade;317
18.5.6.5;Design for part obsolescence;319
18.5.6.6;Design for manufacturing;323
18.5.6.7;Design for anything;325
18.6;System design choices;326
18.6.1;Build versus buy—contributed by Kim R. Fowler;327
18.6.1.1;Definitions;327
18.6.1.2;Custom design;328
18.6.1.3;COTS;328
18.6.1.4;Tradeoffs: parameters of build versus buy;329
18.6.1.5;Cost;330
18.6.1.6;Quantity;334
18.6.1.7;Time;336
18.6.1.8;Product longevity;337
18.6.1.9;Specifications and product complexity;338
18.6.1.10;Resources;339
18.6.1.11;Technical support and training;340
18.6.1.12;Other issues;341
18.6.1.13;How to pick a COTS vendor;342
18.6.1.14;Marketing hype;343
18.7;Approaching a design;344
18.7.1;Processor;346
18.7.2;Algorithms;346
18.7.3;Signal processing chains;347
18.7.4;Apportioning among disciplines;349
18.8;Finding parts;353
18.8.1;Build versus buy tradeoffs;353
18.8.2;Buying off the shelf;355
18.8.3;Repurposing of parts;357
18.8.4;Buying custom-made subsystems;359
18.8.5;Counterfeit parts;362
18.9;System analysis and test;362
18.9.1;System modeling;362
18.9.1.1;Modeling from theory;362
18.9.1.2;Testing and refining models;365
18.9.2;Analysis;367
18.9.2.1;Static and dynamic analysis;367
18.9.2.2;Finding symbolic solutions;370
18.9.2.3;Numerical analysis;371
18.9.2.4;Testing physical models;372
18.9.2.5;Worst-case, nominal, and statistical analysis;373
18.9.3;Types of analysis to perform;374
18.10;References;375
19;9 Mechanical Design;376
19.1;What to expect from this chapter;377
19.2;Materials;377
19.3;Fasteners;382
19.3.1;Goals for choosing fasteners;383
19.3.2;Fastener types;383
19.3.3;Fastener sizes;387
19.3.4;Preload;388
19.4;Fabrication;389
19.5;Finishes;391
19.6;Packaging;394
19.6.1;Enclosures;395
19.6.2;Connectors and cabling;395
19.6.3;Vibration and mechanical shock;400
19.6.4;Thermal cycling;401
19.7;Thermal design;402
19.7.1;Thermal design during the concept phase;404
19.7.2;Define the external shape and estimate maximum power dissipation;406
19.7.3;Estimate overall power and identify power sources;408
19.7.4;Develop plan for thermal heat paths;408
19.7.5;RFI/EMI shielding;409
19.7.6;Cooling of CPU/MPUs;410
19.7.7;Air cooled heat sink design;410
19.7.8;Natural convection heat sinks;411
19.7.9;Selecting a cooling fan;411
19.7.10;Reliability considerations with cooling fans;413
19.7.11;Minimizing noise from fans;413
19.7.12;Heat pipes;415
19.8;Mechanisms;416
19.9;Analysis and test;429
19.9.1;Finite element analysis;434
19.9.2;Vibration analysis;437
19.10;References;444
19.11;Suggested reading;444
20;10 Electronic Design;446
20.1;Overview of electronic design;447
20.1.1;Requirements;448
20.1.2;General processes and procedures;448
20.1.3;Specific requirements;448
20.2;Circuit design;450
20.3;Components;450
20.3.1;Resistors;451
20.3.2;Wirewound resistors;457
20.3.3;The lowly pullup and pulldown resistor;459
20.3.4;Potentiometers and digital potentiometers;459
20.3.5;Capacitors;462
20.3.6;Ceramic capacitors;462
20.3.7;Electrolytic capacitors;464
20.3.8;Tantalum capacitors;466
20.3.9;Film capacitors;466
20.3.10;Silver mica capacitors;467
20.3.11;Inductors;468
20.4;Semiconductors;469
20.5;Visual displays;471
20.5.1;Lamps and LEDs;471
20.5.2;Display devices;472
20.6;Integrated circuits;473
20.6.1;Processors and controllers;473
20.6.2;Power semiconductors;476
20.6.3;Analog semiconductors;480
20.6.4;Digital and mixed-signal semiconductors;482
20.7;Circuit boards;482
20.8;Connectors, cables, and conductors;484
20.8.1;Connectors;484
20.8.2;Cabling;488
20.8.3;Conductors;490
20.8.4;Connections;490
20.9;Operating life (MTBF);491
20.10;Power and power consumption;492
20.10.1;An aside about power consumption;492
20.10.2;Line-operated power supplies;493
20.10.3;Battery-operated and alternative energy systems;494
20.10.4;Notes about unipolar and bipolar (single-ended and double-ended) power supplies;495
20.11;Cooling;497
20.12;Environmental extremes;500
20.13;RFI, EMI, and EMC compliance;501
20.14;Analysis methods;502
20.14.1;Worst case;502
20.14.2;Simulation;502
20.14.3;Monte Carlo simulations;503
20.15;Testing, qualifications, and conflicts;503
20.15.1;Bench tests;503
20.15.2;RFI, EMI, and EMC field tests;504
20.15.3;Environmental tests;504
20.15.4;Potential conflicts;505
20.15.5;Cost versus performance versus schedule;505
20.15.6;Power versus operating life;506
20.15.7;Size versus function versus cost;507
20.16;Built-in self-test;511
20.17;Acknowledgment;513
20.18;References;513
21;11 Software Design and Development;516
21.1;Distinguishing characteristics;518
21.1.1;Minimal operating system support;519
21.1.2;Real-time requirements;520
21.1.3;Real world sensor and actuator interfaces;520
21.1.4;Resource constrained;520
21.1.5;Single purpose;521
21.1.6;Long life cycle;522
21.1.7;Reliability and design correctness;523
21.1.8;Safety;523
21.1.9;Standards and certification;524
21.1.10;Cost;524
21.1.11;Product volume;525
21.1.12;Specialized knowledge;525
21.1.13;Security;526
21.2;The framework for developing embedded software;526
21.2.1;Processes and standards;528
21.2.2;One size doesn’t fit all;529
21.2.3;Process improvement;530
21.2.4;Process overhead;531
21.2.5;Process compliance;532
21.2.6;ISO 12207 reference process;534
21.2.7;Recommended process documents;534
21.2.8;Requirements engineering;538
21.2.9;Version control;540
21.2.10;Effort estimation and progress tracking;543
21.2.11;Life cycle;545
21.3;Tools and techniques;547
21.3.1;Real-time operating systems;547
21.3.2;Design by Contract;549
21.3.3;Drawings;551
21.3.4;Static source code analysis;552
21.3.5;Review;554
21.3.6;Test, verification, and validation;559
21.4;Conclusion;561
21.5;References;561
22;12 Security;562
22.1;Overview;562
22.2;Correctness, safety, and security;563
22.2.1;Security and you (the developer);563
22.2.2;Other players;564
22.2.3;Definitions;564
22.2.3.1;Cryptography;565
22.2.3.2;Careful design and review;565
22.2.3.3;Desired properties;566
22.2.4;Assumptions;567
22.2.4.1;Roots of trust and the Trusted Computing Base (TCB);568
22.2.4.2;Bootstrapping and extending trust;569
22.3;Security engineering;569
22.3.1;Art versus science;569
22.3.2;Defining security requirements;570
22.3.3;Reconciling security with functional requirements;571
22.3.4;Planning for inevitable security failures;572
22.4;Building a secure system;573
22.4.1;Security and process standards;573
22.4.2;Component (COTS) reuse;574
22.4.3;Testing;574
22.5;Chapter references;580
22.6;Suggested reading;581
23;13 Review;582
23.1;Introduction to review;583
23.1.1;Part of a complete feedback system;584
23.1.2;PERRU;584
23.1.3;Review is necessary;584
23.2;General processes and procedures;585
23.2.1;General outline for review;586
23.2.2;Tailoring your review;587
23.2.3;Types of review;588
23.2.4;Frequency of review;589
23.2.5;Course of action, changes, and updates following review;589
23.2.6;Roles and responsibilities;589
23.3;Components of a review;590
23.3.1;Agenda;590
23.3.2;Minutes;592
23.3.3;Action items;593
23.3.4;Checklist;593
23.4;Peer review and inspection;595
23.5;Internal review;595
23.6;Formal design review;596
23.6.1;Types of design reviews;596
23.6.1.1;Conceptual design review;596
23.6.1.2;Preliminary design review;598
23.6.1.3;Critical design review;599
23.6.1.4;Commercial release;600
23.6.2;Other types of design reviews;601
23.7;Change control board;602
23.8;Failure review board;602
23.9;Audits and customer reviews;602
23.10;Static versus dynamic analysis;603
23.11;Debrief;603
23.12;Acknowledgments;603
23.13;References;604
24;14 Test and Integration;606
24.1;Introduction;607
24.1.1;The reasons for testing and integration;607
24.1.2;Part of a complete feedback system;609
24.1.3;The goals for a complete test and integration program;610
24.1.4;Overview of test and integration;611
24.1.4.1;Bench tests;611
24.1.4.2;Mockups and fit checks;611
24.1.4.3;Unit and module tests;612
24.1.4.4;Fault injection tests;612
24.1.4.5;Verification and validation;612
24.1.4.6;Integration;613
24.1.4.7;Calibration and alignment checks;613
24.1.4.8;Field tests or trials;613
24.1.4.9;Compliance;613
24.1.4.10;Environmental tests;613
24.1.4.11;Security tests;614
24.1.4.12;Stress;614
24.1.4.13;Highly accelerated life test;614
24.1.4.14;When to use which tests;614
24.1.4.15;No simulation or manufacturing tests here;614
24.2;General processes and procedures;614
24.3;Test plan;615
24.3.1;Contributors to a test plan;617
24.3.2;Elements of a test plan;617
24.4;Verification;617
24.5;Validation;620
24.6;Field trial and testing;622
24.7;Integration;623
24.8;Calibration and alignment checks;624
24.9;Environmental tests;624
24.9.1;Thermal cycling, chamber testing;625
24.9.2;Vibration and shock;628
24.9.3;Humidity, condensation, and salt spray, chamber testing;633
24.9.4;Other concerns;634
24.9.5;Stress testing;634
24.10;Highly accelerated life test;635
24.11;Compliance testing;635
24.11.1;Aerospace;635
24.11.2;FDA;636
24.11.3;Underwriters Laboratory;636
24.11.4;CE marking;636
24.11.5;Military;638
24.12;Other issues to consider;638
24.12.1;Measurement science;638
24.12.2;Automation versus skilled manual test;639
24.12.3;Manufacturing test;639
24.13;Acknowledgment;639
24.14;References;640
24.15;Suggested reading;640
25;15 Manufacturing;642
25.1;Overview of manufacturing;643
25.2;Some philosophical issues with manufacturing;644
25.3;General processes and procedures;647
25.3.1;Electrical and electronic;647
25.3.2;Mechanical;649
25.3.3;Fabrication;649
25.3.4;Assembly;649
25.3.5;Tests and inspections;649
25.3.6;Production handoff;649
25.4;Specifics of fabrication and assembly;650
25.4.1;Electronic circuit boards;650
25.4.1.1;Basic definitions;650
25.4.1.2;Fabricating PWBs;652
25.4.1.3;Fabricating and assembling commercial circuit boards;653
25.4.1.4;Fabricating and assembling space-qualified circuit boards;661
25.4.1.4.1;Example fabrication for simple, space-qualified circuit boards;664
25.4.1.4.2;Example fabrication for complex, space-qualified circuit boards;666
25.4.1.4.3;Example fabrication for rigid–flex, space-qualified circuit boards;668
25.4.1.4.4;Summary comparison between different types of space-qualified circuit boards;668
25.4.1.4.5;Common manufacturing tradeoffs for space-qualified circuit boards;670
25.4.1.4.6;Some basic issues common to manufacturing space-qualified circuit boards;671
25.4.1.5;Fabricating and assembling military or industrial circuit boards;672
25.4.2;Electrical wires, cables, and harnesses;675
25.4.3;Mechanical;679
25.4.3.1;Materials;679
25.4.3.2;Enclosures and circuit board attachment;680
25.4.3.3;Mechanisms, fluids, and tubing;682
25.4.3.4;Module and subsystem attachment;683
25.4.4;Automated versus robotic versus manual;683
25.5;Production test;684
25.5.1;Electronics;684
25.5.1.1;Circuit boards;684
25.5.1.2;Cables and wires;685
25.5.2;Mechanical;685
25.5.3;ATE versus BIT versus BITE;686
25.6;Considerations in manufacturing;686
25.6.1;Quality systems;686
25.6.2;Standards;686
25.6.3;Supply chain;687
25.6.4;Contract manufacturing;687
25.6.4.1;Capabilities of contract manufacturing;688
25.6.4.2;Concerns for contract manufacturing;688
25.6.4.3;Selecting a contract manufacturer;689
25.6.5;Design transfer;693
25.6.6;Captive production facility;693
25.7;Acknowledgments;694
25.8;References;694
26;16 Logistics, Distribution, and Support;696
26.1;Overview of logistics, distribution, and support;697
26.1.1;Business logistics;698
26.1.2;Distribution logistics;698
26.1.3;Support;698
26.1.4;Maintenance and repair;699
26.1.5;Disposal;699
26.1.6;Definitions;699
26.1.7;Caveat;700
26.2;Market release;700
26.3;Distribution and delivery;700
26.3.1;Issues with distribution;701
26.3.1.1;Distribution centers;701
26.3.1.2;Order and delivery timing;702
26.3.1.3;Lean supply and flow control;702
26.3.1.4;Third-party logistics providers;702
26.3.1.5;It’s all about costs and time;702
26.3.1.6;Some comparisons of costs and delivery times for shipping;704
26.3.1.7;Some thoughts on warehouse costs;704
26.4;Packaging;706
26.5;Inventory;709
26.6;Sales support;710
26.7;Technical support;711
26.7.1;Tier 1, Tier 2, and Tier 3;711
26.7.2;Technical marketing;712
26.8;Training;712
26.8.1;Website;712
26.8.2;Users Manual;712
26.8.3;Tutorials;713
26.9;Maintenance and replenishment;713
26.9.1;Condition-based monitoring and maintenance;714
26.9.2;Predictive analytics;714
26.9.3;Some further issues in maintenance;715
26.10;Diagnosis and repair;715
26.10.1;Supportability;716
26.11;Recalls, patches, and updates;717
26.12;Reverse and green logistics and disposal;718
26.12.1;WEEE Directive;718
26.12.2;RoHS;718
26.13;Acknowledgment;719
26.14;References;719
26.15;Suggested reading;719
27;17 Agreements, Contracts, and Negotiations;720
27.1;Interpretation of contracts generally;720
27.2;The signing of agreements;723
27.3;The ubiquitous NDA;725
27.4;MOU means IOU;727
27.5;A word on negotiations of contracts;729
27.6;Humble negotiations with the Big Guy (reprinted with permission from the September 2001 IEEE Instrumentation and Measuremen...;732
27.6.1;A lop-sided negotiation;733
27.6.2;Commitment is gold;733
27.6.3;Stick to what you say;734
28;18 Dealing with the Government;736
28.1;Considerations in US federal government contracts;736
28.2;The government’s right to change;736
28.3;The government’s right to terminate;737
28.4;Ethical issues in government contracts;737
28.5;Some criminal statutes relevant to government contracting;738
28.6;The government contractor defense;739
29;19 Agency and Getting Paid;740
29.1;Agency;740
29.2;Why are agency relations so important?;740
29.2.1;Scope of agency;742
29.3;Getting paid;743
29.3.1;Documentary collection;744
29.4;Bankruptcy—what does his problem have to do with me?;745
30;20 Intellectual Property, Licensing, and Patents;748
30.1;Software licensing, source code, and somebody going broke;748
30.1.1;Software licensing in general;750
30.2;Protection of intellectual property;752
30.3;Copyrights and the embedded engineer;752
30.4;Protection of trade secrets;753
30.5;Trademarks;759
30.5.1;The use and misuse of trademarks;760
30.6;Patents;763
30.6.1;What is patentable and patent litigation;763
30.6.2;Beware the troll;770
30.6.3;Beware the non-troll;772
30.6.4;The America Invents Act;772
31;21 Open-Source Software;780
31.1;Best read in a Volkswagen minibus;780
31.2;Top 20 most commonly used licenses in open-source projects;784
31.3;Most recent projects to convert to GPLv3, LGPLv3, or AGPLv3;785
31.4;Public domain and shareware;785
31.5;Litigation and an open-source license;785
32;22 Laws That Can Nail Embedded Engineers;788
32.1;The Digital Millennium Copyright Act;788
32.2;Stored Communications Act;790
32.3;The Computer Fraud and Abuse Act 18 USC § 1030;790
32.4;Torts and the engineer;791
32.4.1;Negligence;791
32.4.2;Limiting exposure;792
32.4.3;Products liability;795
32.4.4;Public policy;795
32.4.5;Elements of products liability;796
32.4.6;Minimizing risk in embedded system product development;799
33;23 Corporate Operations;802
33.1;The charter;802
33.2;Shares and stocks;803
33.3;Hiring or contracting with foreigners;804
33.4;So you want to export;805
33.4.1;Bribery;805
33.4.2;Export restrictions;806
33.4.3;Cryptography issues;806
33.4.4;ITAR issues;807
33.4.5;Export of high-performance computers (Section 732.3 of the EAR);807
33.4.6;Controls on HPC exports;808
33.5;Antiboycott considerations (ignoring, “I told you not to play with her!”);809
33.6;Arbitration clauses under international contracts;809
33.7;Insurance;810
33.8;Compliance—or why won’t you comply?;811
33.8.1;Typical compliance certifications done by a representative US datacom manufacturer for new telecom products;811
33.8.2;CE mark;813
34;24 Case Studies;816
34.1;Introduction;816
34.2;Two case studies from the Oak Ridge National Laboratory: development of real-time instrumentation systems;816
34.2.1;Introduction;817
34.2.2;ORNL case study 1—development of the CBMS;817
34.2.2.1;Statement of the situation;817
34.2.2.2;Issues;818
34.2.2.3;Solution;818
34.2.2.4;Evaluation of effectiveness;819
34.2.3;ORNL case study 2—development of the Common Radar Environment Simulator;820
34.2.3.1;Statement of the situation;820
34.2.3.2;Issues;821
34.2.3.3;Solution;823
34.2.3.4;Evaluation of effectiveness;823
34.3;Case study 3: design of a parallel computer-based, streaming digital video instrument;825
34.4;Case study 4: troubleshooting a boiler points out the need for good, comprehensive design and development;828
34.5;Case study 5: debugging of electromagnetic compatibility issues;830
34.6;References;838
35;Appendix A: Dependability Calculations;840
35.1;Brief overview;840
35.2;Observed failure rates;841
35.3;First approximation: simplified failure rates;841
35.3.1;Reliability with multiple components: simplex system;843
35.3.2;Reliability with multiple components: identical parallel units in the system;844
35.3.3;Maintainability;845
35.3.4;Availability;845
35.3.5;Defining reliability: mechanical wear out;845
35.4;Experimental analysis;846
35.5;Recommended Reading;846
35.6;References;847
36;Index;848

Leseproben

Author’s Biographies
Chapter Authors

Allison Fritz is an Organization Development and Facilitation professional with over 20 years’ experience in a variety of industries. Presently working as a Sr. Organization Development and Training Consultant with the Johns Hopkins Health System, she has also worked within higher education, the petroleum industry, and independent consulting, serving both Fortune 100 and small business, designing and facilitating processes. Allison’s expertise is in team development, change management, leader development, strategic visioning, and coaching. With 14 years in management roles, she applies her experience to her work. Allison has a doctoral degree in Organization and Staff Development from the University of Maryland College Park, a Master’s degree in Counseling and Student Personnel, and a Bachelor’s degree in Communications and Psychology from the University of Delaware; as well as holds several certifications including, Emotional Intelligence (EQ2.0, 360), Crucial Conversations, Strong Interest Inventory, and MBTI. Allison focuses her work on encouraging leaders, teams and organizations to realize positive change.
Michael F. (Mike) Gard, received his BSEE from Kansas State University, MSEE (Interdepartmental Program in Biomedical Engineering) from Washington University in St. Louis, and PhDEE (Geophysics minor) from Southern Methodist University. He has over 40 years of industrial experience in aircraft, medical equipment, clinical engineering, petroleum, and construction industries. He is presently Sr. Product Design Engineer at The Charles Machine Works, Perry, OK. An adjunct professor, he occasionally teaches at Oklahoma State University. He is a registered professional engineer, patent agent, inventor (34 US patents), author, member of the IEEE Instrumentation and Measurement Society’s Administrative Committee, and editor-in-chief of IEEE Instrumentation and Measurement Magazine. His technical interests include real-time data acquisition and precision analog and analog/digital systems for low power and hostile environments.
Robert Oshana has 30 years of experience in the software industry, primarily focused on embedded and real-time systems for the defense and semiconductor industries. He has BSEE, MSEE, MSCS, and MBA degrees and is a senior member of IEEE. He is a member of several Advisory Boards including the Embedded Systems group, where he is also an international speaker. He has over 200 presentations and publications in various technology fields and has written several books on Embedded software technology including “Software Engineering for Embedded Systems.” He is an adjunct professor at Southern Methodist University where he teaches graduate software engineering courses. He is a distinguished member of Technical Staff and Director of Global Software R&D for Digital Networking at Freescale Semiconductor.
Geoff Patch has over 30 years experience as a software engineer. He has worked for the Australian government, in academia, and for a number of engineering companies. Since 1987, he has specialized in embedded systems, primarily in the areas of radar target tracking, radar signal processing, and command and control systems. He is also keenly interested in software process improvement, technical team leadership, and technical management. He has developed software for numerous commercially successful radar systems ranging from conventional maritime surveillance, through specialized applications such as submarine periscope detection and up to large air defense systems. He is currently the manager of a team of nearly 30 software engineers involved in the development of new radar systems at CEA Technologies in Canberra, Australia.
Eugene Vasserman received his PhD and master’s degrees in Computer Science in 2010 and 2008, respectively, from the University of Minnesota. His BS, in Biochemistry and Neuroscience with a Computer Science minor, is also from the University of Minnesota (2003). In 2013, he received the NSF CAREER award for work on secure next generation medical systems.
Tim Wescott has 25 years of real-world experience in embedded systems design, with roles ranging from software designer to circuit designer to systems architect. Tim has worked on small, inexpensive hand-held instruments, on large airborne imaging systems, and on nearly everything in between. He has experience in all phases of system life cycles, ranging from designing new systems from a clean sheet of paper to extending the useful lives of systems that are on the verge of obsolescence. Tim is author of “Applied Control Theory for Embedded Systems”, aimed at engineers who slept through control theory class in University, and who now need to design a system that must successfully implement a feedback control loop. Tim is the owner of Wescott Design Services, which provides analysis, design, and troubleshooting of embedded control systems, with a particular emphasis on control of dynamic systems, low-level communications systems, and metrology. Wescott Design Systems has helped customers of all sorts of problems ranging from drives for 1/2-inch diameter brushless motors to implementing communications systems for deep-well drilling platforms.
Steve Zeise is a mechanical engineer and designer with 30 years’ experience in all things mechanical. He received a BS in Mechanical Engineering from Rose-Hulman Institute of Technology and immediately went to work for Westinghouse Defense and Electronics Systems Center designing mechanisms, structures, and cooling systems supporting embedded systems in night vision cameras. With positions at Northrop-Grumman and Lockheed Martin, he gained experience in structural analysis and environmental testing. He is currently with FLIR Systems where he helped to setup a small R&D facility in Orlando, FL and for the past 15 years has worked to help FLIR Systems solve complex vibration problems. Case Study Authors
David von Oheimb received his PhD in computer science in 2001 from the Munich University of Technology, where he focused on machine-assisted formal modeling and verification of the programming language Java. He joined Siemens Corporate Technology, where he became a senior researcher, developer, and key expert consultant on IT security. His specific areas of expertise are security architecture, formal analysis, and IT security certification according to the Common Criteria. He has been involved as participant and leader of various Siemens-internal and EU-funded R&D projects on security protocol and information flow analysis using model checkers and theorem provers and of various industrial projects dealing for instance with Infineon smart cards, software update mechanisms for Boeing and Continental Automotive, and German and Austrian smart metering systems. Kenneth W. Tobin is the Director of the Electrical and Electronics Systems Research (EESR) Division at the Oak Ridge National Laboratory (ORNL), Oak Ridge, Tennessee, USA, where he has been working in various R&D and leadership capacities since 1987. The EESR Division is composed of 150 staff who perform R&D in electronics, sensors, communications, and controls for energy efficiency, resiliency, and security. His personal research areas encompass photonics, neutronics, x-ray, SEM, electronic imaging and microscopy coupled with signal processing and machine learning. Science and technology specialty in computational imaging, image metrology, object segmentation, and feature generation from multi-spectral, multi-source imagery for inverse imaging, robust human-level classifiers, image archival and retrieval applications, and image-based informatics. Dr. Tobin was named an ORNL Corporate Research Fellow in 2003 for his contributions to the field of applied computer vision research. He has authored and co-authored over 164 publications and he currently holds fourteen U.S. Patents in areas of computer vision, photonics, radiography, and microscopy. Dr. Tobin is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE) and a Fellow of the International Society for Optics and Photonics (SPIE), where he is currently an Associate Editor for the Journal of Electronic Imaging. Dr. Tobin has a Ph.D. in Nuclear Engineering from the University of Virginia, an M.S. in Nuclear Engineering from Virginia Tech, and a B.S. in Physics also from Virginia Tech. Dwight A. Clayton is the group leader of the Electronic and Embedded Systems group at the Oak Ridge National Laboratory (ORNL), Oak Ridge, TN. The mission of the Electronic and Embedded Systems (EESG) group is to apply modern electronic methods to provide solutions to challenges that are important to the ORNL, the Department of Energy, other federal agencies, and private industry. He joined ORNL in 1983 as a development staff member in the Instrumentation and Controls Division. In 1994, he was named leader of the Electronic and Embedded Systems Group. Since 2000, the innovative efforts of the Electronic and Embedded Systems group have resulted in the receipt of four R&D 100 awards. He has an MS and BS in electrical engineering from Tennessee Technological University. Bogdan Vacaliuc is a research and development staff member in the Electronic and Embedded Systems Group of the Oak Ridge National Laboratory’s Measurement Science and Systems Engineering Division....