Buch, Englisch, 300 Seiten, Format (B × H): 210 mm x 235 mm
Buch, Englisch, 300 Seiten, Format (B × H): 210 mm x 235 mm
ISBN: 978-1-4614-4246-2
Verlag: Springer-Verlag New York Inc.
This book covers the RF domain from the very basics to the more complicated, from the device level to the integrated circuits level. The discussion takes the reader from the beginning of conceiving an optimized silicon wafer for RF applications, through the RF oriented device conception and the in-depth RF device characterization, in order to achieve a fully optimized, RF integrated circuit. Throughout this cycle, performance optimization is addressed from various perspectives, including high temperature (an unavoidable side effect in today’s devices), low power consumption (required in all portable applications), noise, nonlinearities, crosstalk, etc.
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
High frequency behavior of semiconductor devices.- Wideband characterization methodology: Hands-on.- A wide variety of MOSFET Technologies.- Integration of RF Passive Elements.- Towards a Successful RF Circuit Design.




