E-Book, Englisch, Band 24, 334 Seiten, eBook
Dziuban Bonding in Microsystem Technology
2006
ISBN: 978-1-4020-4589-9
Verlag: Springer Netherland
Format: PDF
Kopierschutz: 1 - PDF Watermark
E-Book, Englisch, Band 24, 334 Seiten, eBook
Reihe: Springer Series in Advanced Microelectronics
ISBN: 978-1-4020-4589-9
Verlag: Springer Netherland
Format: PDF
Kopierschutz: 1 - PDF Watermark
This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.
Zielgruppe
Research
Autoren/Hrsg.
Weitere Infos & Material
Acknowledgments. List of Acronyms and Symbols. 1. Introduction. 2. Some remarks on microsystem systematic and development. 2.1 Literature 3. Deep three-dimensional silicon micromachining. 3.1 Micromechanical substrates and mechanical properties of silicon. 3.2 Wet anisotropic etching of silicon. 3.3 Basic micromechanical constructions. 3.4 Literature 4. Bonding. 4.1 Surface cleaning and activation. 4.2 High temperature fusion bonding. 4.3 Low temperature bonding. 4.4 Anodic (electrostatic) bonding. 4.5 Literature 5. Classification of bonding and closing remarks. 5.1 Literature
