Buch, Englisch, 172 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 329 g
Buch, Englisch, 172 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 329 g
Reihe: CPSS Power Electronics Series
ISBN: 978-981-19-3134-5
Verlag: Springer Nature Singapore
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Introduction.- Thermal fatigue failure mechanism of power devices in renewable energy system.- Thermal model and thermal parameters monitoring.- Thermal analysis of power semiconductor device in renewable energy system.- Multi-time scale lifetime evaluation for the device in the renewable application.- Thermal management design and optimization.- Prospect.