The manufacturing issues
Buch, Englisch, 242 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1190 g
ISBN: 978-0-412-55340-0
Verlag: Springer US
This is a state-of-the-art guide to SMT with fine pitch components intended for professionals in electronics manufacturing. The overriding objective is to equip manufacturing people in the electronics industry with a better understanding of the manufacturing processes involved.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Geisteswissenschaften Design Produktdesign, Industriedesign
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Werkzeugbau
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
- Technische Wissenschaften Technik Allgemein Konstruktionslehre und -technik
Weitere Infos & Material
Foreword. Introduction. Economic aspects of manufacturing. Driving forces in electronics. Basic properties of solder materials. Printing of solder pastes for fine pitch components. The printing process. The soldering process. Parameters influencing soldering results. Optimization of soldering results. Design related manufacturing problems. Manufacturing problems specific to fine pitch components. Soldering process influence on component reliability. Limitations of current surface mounting technology and new packages types. Future manufacturing technologies.
