Chung / Ltd Composite Materials for Electronic Functions

Erscheinungsjahr 2000
ISBN: 978-3-0357-0593-5
Verlag: Trans Tech Publications
Format: PDF
Kopierschutz: 0 - No protection

E-Book, Englisch, 88 Seiten

Composite materials are traditionally designed for the mechanical properties, due to their structural applications. However, composite materials are increasingly used in non-structural applications, such as electronic packaging and thermal management. Moreover, structural composite materials that are multifunctional are increasingly needed, due to the demand of smart structures and the importance of weight saving. As a consequence, structural materials that can provide electronic functions are needed. Thus, electronic functions are desirable for both non-structural and structural composite materials.

Autoren/Hrsg.

Chung, D.D.L.

Ltd, Trans Tech Publications

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde

Inhaltsverzeichnis

Contents
1. Preface. Introduction. 2. Non-Structuralcomposite Materials for Electronic Functions
2.1 Backgroundon Electronic Packaging
2.2 Polymer-Matrix Composites
2.3 Metal-Matrixcomposites
2.4 Carbon-Matrix Composites
2.5 Ceramic-Matrixcomposites
3. Structuralcomposite Materials for Electronic Functions
3.1 Cement-Matrixcomposites for Smart Structures
3.2 Polymer-Matrix Composites for Smartstructures
4. Conclusion
Acknowledgement and References