Stochastic Finite Element Modeling in Electronic Packaging

1. Auflage 2025
ISBN: 978-1-394-35294-4
Verlag: Wiley

Buch, Englisch, 304 Seiten

An expert integration of digital twin technology and advanced simulation methods for the design and optimization of electronic packaging systems

In Stochastic Finite Element Modeling in Electronic Packaging, distinguished researcher Liu Chu delivers an expert discussion of the latest advanced numerical methods and modeling techniques specific to electronic packaging. The book supplements its explanations with original MATLAB and ANSYS (APDL) code that can be applied immediately. It also includes robust examples that draw on a comprehensive description of the mechanics of electronic packaging modeling.

Chu explains the fundamentals of modeling logic and concepts in an accessible way that is ideal for beginners to the topic. She demonstrates practical guides and benchmarks that will assist readers in the testing, measurement, and modeling of their own materials.

Readers will also find: - A thorough introduction to a modeling approach that focuses on digital twins and big data applications, including Monte Carlo Sampling
- Comprehensive explorations of benchmarks, testing, measurement, and modeling
- Practical discussions of theoretical finite element models in electronic packaging
- Complete treatments of the fundamentals of modeling logic and concepts

Perfect for undergraduate and graduate students in electrical engineering and computer science, Stochastic Finite Element Modeling in Electronic Packaging will also benefit practicing electronic design engineers and academic researchers with an interest in electronic packaging and materials science.

Autoren/Hrsg.

Chu, Liu

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik
• Mathematik | Informatik Mathematik Numerik und Wissenschaftliches Rechnen Numerische Mathematik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise

Inhaltsverzeichnis

Chapter 1. Overview

Chapter 2. Electronic packaging

Chapter 3. Random Sampling Methods

Chapter 4. Random Fields and Stochastic Processes

Chapter 5. Reliability Prediction

Chapter 6. Finite element method

Chapter 7. Nonlinear Stochastic finite element method

Chapter 8. Random shear stress and thermal temperature

Chapter 9. Material uncertainty in electro-migration

Chapter 10. Mechanical reliability in the replaceable integrated chiplet assembly

Chapter 11. Kriging Surrogate Model

Chapter 12. Digital twins based on SFEM

Über Autor(innen)

Liu Chu, PhD, is a Senior Researcher in the School of Physical Science and Technology at ShanghaiTech University. Her research is primarily focused on uncertainty quantification in stochastic defects, numerical simulations for electronic packaging, and the development of advanced computational mechanics methods.