Buch, Englisch, Band 17, 2127 Seiten, Format (B × H): 170 mm x 244 mm, Gewicht: 3836 g
Reihe: Review of Progress in Quantitative Nondestructive Evaluation
Volume 17A/17B
Buch, Englisch, Band 17, 2127 Seiten, Format (B × H): 170 mm x 244 mm, Gewicht: 3836 g
Reihe: Review of Progress in Quantitative Nondestructive Evaluation
ISBN: 978-1-4613-7436-7
Verlag: Springer US
These Proceedings, consisting of Parts A and B, contain the edited versions of most of the papers presented at the annual Review of Progress in Quantitative Nondestructive Evaluation held at University of San Diego, San Diego, CA, on July 27 to August 1, 1997. The Review was organized by the Center for NDE at Iowa State University, in cooperation with the Ames Laboratory of the USDOE, the American Society of Nondestructive Testing, the National Institute of Standards and Technology, the Federal Aviation Administration, and the National Science Foundation IndustrylUniversity Cooperative Research Centers. This year's Review of Progress in QNDE was attended by approximately 370 participants from the US and many foreign countries who presented a total of approximately 350 papers. As usual, the meeting was divided into 36 sessions with four sessions running concurrently. The Review covered all phases of NDE research and development from fundamental investigations to engineering applications and inspection systems, and methods of inspection science from acoustics to x-rays. The Review continues to experience some fluctuations in size, mostly under pressure from a decrease in funding for NDE research at the US Federal level, but increased participation from foreign laboratories has more than made up the difference. The Review is ideally sized to permit a full-scale overview of the latest developments in a collegial atmosphere that most participants favor. The opening plenary session this year concentrated on advances in imaging technologies and methodologies that have been made in recent years. Dr. K.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Special Topics.- 1. Standard Techniques.- 2. Emerging Technologies.- 3. Signal Processing and Image Analysis.- 4. NDE Sensors and Fields.- Special Topic.- 5. Engineered Materials.- 6. Materials Characterization.- 7. New Inspection/Control Procedures.- 8. Systems, Reliability, Training.- Attendees.- Contributors Index.
