Buch, Englisch, 172 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 289 g
First EAI International Conference, SmartSP 2023, Chicago, USA, October 12-13, 2023, Proceedings
Buch, Englisch, 172 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 289 g
ISBN: 978-3-031-51629-0
Verlag: Springer Nature Switzerland
This book constitutes the refereed proceedings of the First EAI International Conference, SmartSP 2023, held in Chicago, USA, during October 12-13, 2023.
The 11 revised full papers were carefully reviewed and selected from 24 submissions. The papers focus on all details all technological aspects that are relevant to Security and privacy in cyber-physical systems.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Mathematik | Informatik EDV | Informatik Computerkommunikation & -vernetzung
- Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik
- Mathematik | Informatik EDV | Informatik Informatik Künstliche Intelligenz
- Mathematik | Informatik EDV | Informatik Informatik Rechnerarchitektur
- Mathematik | Informatik EDV | Informatik Angewandte Informatik
Weitere Infos & Material
Main Track.- Exploring Vulnerabilities in Voice Command Skills for Connected Vehicles.- Enabling Real-Time Restoration of Compromised ECU Firmware in Connected and Autonomous Vehicles.- mmFingerprint: A New Application Fingerprinting Technique via mmWave Sensing and Its Use in Rowhammer Detection.- ADC-Bank: Detecting Acoustic Out-of-Band Signal Injection on Inertial Sensors.- Invited Track.- Invited Track.- An Efficient and Smooth Path Planner Based on Hybrid A* Search and Frenet Frames.- Application of Large Language Models to DDoS Attack Detection.- Embracing Semi-Supervised Domain Adaptation for Federated Knowledge Transfer.- A Lightweight Reputation System for UAV Networks.- Resilient Range-only Cooperative Positioning of Multiple Smart Unmanned Aerial Systems.- Securing the Future: Exploring Privacy Risks and Security Questions in Robotic Systems.- Waves of Knowledge: A Comparative Study of Electromagnetic and Power Side-Channel Monitoring in Embedded Systems.