E-Book, Englisch, 132 Seiten, eBook
Chatterjee Legacy Data: A Structured Methodology for Device Migration in DSM Technology
Erscheinungsjahr 2012
ISBN: 978-1-4615-0241-8
Verlag: Springer US
Format: PDF
Kopierschutz: 1 - PDF Watermark
E-Book, Englisch, 132 Seiten, eBook
ISBN: 978-1-4615-0241-8
Verlag: Springer US
Format: PDF
Kopierschutz: 1 - PDF Watermark
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Weitere Infos & Material
1. Introduction.- 2. Legacy Data.- 2.1 Modem SOCFlow.- 2.2 Legacy Data Review.- 3. Reasons for Data Migration.- 3.1 Functional reuse in derivative products.- 4. New Rules for DSM Flows.- 4.1 Device Geometries.- 4.2 Wafer Type.- 4.3 Isolation technique.- 4.4 Operating Voltage.- 4.5 Process design rules.- 4.6 Device performance.- 4.7 Interconnect options.- 4.8 Memory techniques.- 4.9 OPC masking techniques.- 5. Structured Methodology.- 5.1 Assumptions formigration.- 5.2 Flowchart of methodology.- 5.3 Sequence of the methodology.- 6. Screening Criteria for Blocks.- 6.1 Introduction of Case Study.- 6.2 Block Selection.- 6.3 Description of Selection Criteria.- 7. Process Compatibility.- 7.1 Process migration tradeoffs.- 7.2 Sample USB block tradeoff analysis.- 8. Test Bench Requirements.- 8.1 Test bench minimum requirements.- 8.2 Digital Test Bench.- 8.3 Device Level Test Bench.- 8.4 USB Sample Summary.- 9. Block Identification.- 9.1 Physical and Design Views.- 9.2 Multiple View Correction.- 9.3 Hierarchy Tree.- 9.4 Test Circuits, Clocks and Power Grids.- 10. Design Retargeting.- 10.1 Device Level Re-Design Stages.- 10.2 Re-Engineering Process - Device Level Design.- 10.3 Re-Engineering Process - Corner Based Design.- 10.4 Summary for USB Block Migration.- 11. Design Validation.- 11.1 Types of Validation.- 11.2 Case Study Validation Summary.- 12. Physical Design Migration.- 12.1 Physical Migration Options.- 13. Post Layout Validation Ill.- 13.1 Design Rule Checking - DRC Ill.- 13.2 Layout Vs. Schematic - LVS.- 13.3 Power Analysis - IR Drop.- 13.4 Noise Analysis and Coupling - Signal Integrity.- 13.5 RC Extraction for STA & for Device Simulation.- 13.6 Case Study Summary for Physical Verification.- 14. Full Chip Verification.- 14.1 Abstracts Required.