Analysis and Optimization for IC Design
Buch, Englisch, 172 Seiten, Format (B × H): 210 mm x 297 mm, Gewicht: 524 g
ISBN: 978-1-4757-7439-9
Verlag: Springer US
addresses the main problems posed by substrate noise from both an IC and a CAD designer perspective. The effects of substrate noise on performance in digital, analog, and mixed-signal circuits are presented, along with the mechanisms underlying noise generation, injection, and transport. Popular solutions to the substrate noise problem and the trade-offs often debated by designers are extensively discussed. Non-traditional approaches as well as semi-automated techniques to combat substrate noise are also addressed.
will be of interest to researchers and professionals interested in signal integrity, as well as to mixed signal and RF designers.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Noise Coupling Mechanisms.- Analysis and Simulation.- Substrate Modeling.- Constraint Generation.- Optimization Techniques.- Impact of Substracte on Performance.- Physical Design Guidelines.- Conclusion.