Budiman Probing Crystal Plasticity at the Nanoscales

Synchrotron X-ray Microdiffraction
2015
ISBN: 978-981-287-335-4
Verlag: Springer Nature Singapore
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 123 Seiten

Reihe: SpringerBriefs in Applied Sciences and Technology

This Brief highlights the search for strain gradients and geometrically necessary dislocations as a possible source of strength for two cases of deformation of materials at small scales: nanoindented single crystal copper and uniaxially compressed single crystal submicron gold pillars.When crystalline materials are mechanically deformed in small volumes, higher stresses are needed for plastic flow. This has been called the 'Smaller is Stronger' phenomenon and has been widely observed. studies suggest that plasticity in one case is indeed controlled by the GNDs (strain gradient hardening), whereas in the other, plasticity is not controlled by strain gradients or sub-structure hardening, but rather by dislocation source starvation, wherein smaller volumes are stronger because fewer sources of dislocations are available (dislocation starvation hardening).

Dr. Arief Suriadi Budiman received his Ph.D. in Materials Science and Engineering from Stanford University, CA. Before deciding to pursue his doctoral career, he first embarked on his technical career with Hewlett-Packard, Co in Singapore researching and developing microfabrication processes for HP's latest generation of inkjet print head MEMS chip. During his doctoral candidacy at Stanford's Department of Materials Science & Engineering under the supervision of Professor William D. Nix (MRS Von Hippel Award 2007), Dr. Budiman received several research awards (MRS Graduate Silver Award 2006, MRS Best Paper 2006) and contributed to several journal publications. Most recently Dr. Budiman has been awarded the prestigious Los Alamos National Laboratory (LANL) Director's Research Fellowship to conduct top strategic research for the energy and national security missions of the Los Alamos National Laboratory's. At the Center for Integrated Nanotechnologies (CINT) at Los Alamos, Dr. Budiman's research program involves nanoscale multilayered composite materials for extreme environments with potential applications in advanced energy systems including for next generation nuclear power reactors.

Autoren/Hrsg.

Budiman, Arief Suriadi

Budiman, Arief

Inhaltsverzeichnis

1;Acknowledgments;6
2;Contents;8
3;1 Introduction;11
3.1;Abstract;11
3.2;1.1 Small Scale Plasticity;11
3.3;1.2 White-Beam X-ray Microdiffraction as Plasticity Probe;13
3.4;1.3 Electromigration in Metallic Interconnects;14
3.4.1;1.3.1 Electromigration Fundamentals;14
3.4.2;1.3.2 Electromigration Degradation Mechanisms in Cu Interconnects;16
3.5;1.4 Size Effects in Crystalline Materials;17
3.5.1;1.4.1 Classical Flow-Stress Relationship: The Taylor Relation;19
3.5.2;1.4.2 The Nix and Gao Model of Strain Gradient Plasticity;20
3.6;References;21
4;2 Synchrotron White-Beam X-ray Microdiffraction at the Advanced Light Source, Berkeley Lab;24
4.1;Abstract;24
4.2;2.1 Introduction;24
4.3;2.2 Beamline Components and Layout;25
4.4;2.3 Scanning White-Beam X-ray Microdiffraction;27
4.4.1;2.3.1 Experimental Procedure;27
4.4.2;2.3.2 Data Analysis Using XMAS;29
4.4.2.1;2.3.2.1 Laue Peak Searching and Indexation;30
4.4.2.2;2.3.2.2 Crystal Unit Cell Parameter Determination;34
4.4.2.3;2.3.2.3 Strain/Stress Tensor Calculation;35
4.5;2.4 Local Plasticity Probing Using Whitebeam mu XRD;37
4.5.1;2.4.1 Crystal Bending, Polygonization and Rotation;38
4.5.2;2.4.2 Quantitative Peak Study;40
4.6;References;43
5;3 Electromigration-Induced Plasticity in Cu Interconnects: The Length Scale Dependence;45
5.1;Abstract;45
5.2;3.1 Introduction;45
5.3;3.2 Background;46
5.4;3.3 Experimental;47
5.5;3.4 Results and Discussion;48
5.5.1;3.4.1 Microstructure of the Cu Interconnect Lines;48
5.5.2;3.4.2 Evolution of Cu Grains During Electromigration;50
5.5.3;3.4.3 Electromigration-Induced Plasticity: The Linewidth Effects;52
5.5.4;3.4.4 Electromigration-Induced Plasticity: The Directionality;54
5.5.5;3.4.5 Correlation Between In-Plane Texture and Occurrence of Plasticity;56
5.5.6;3.4.6 The Out-of-Plane Crystallographic Texture of the Cu Lines;58
5.6;3.5 Conclusions;59
5.7;References;60
6;4 Electromigration-Induced Plasticity in Cu Interconnects: The Texture Dependence;61
6.1;Abstract;61
6.2;4.1 Introduction;61
6.3;4.2 Background;62
6.3.1;4.2.1 Electromigration-Induced Plasticity in Metallic Interconnects;62
6.3.2;4.2.2 Microstructural Characterization of Cu Lines Manufactured by AMD;63
6.3.3;4.2.3 Influence of Dielectrics on Mechanical Stresses and Plastic Deformation;64
6.4;4.3 Experimental;66
6.5;4.4 Results and Discussions;67
6.5.1;4.4.1 EM-Induced Plasticity: Directionality and Extent;67
6.5.2;4.4.2 Influence of Dielectrics;70
6.5.3;4.4.3 Proposed Correlation: Texture Versus EM-Induced Plasticity;71
6.6;4.5 Conclusions;74
6.7;References;74
7;5 Industrial Implications of Electromigration-Induced Plasticity in Cu Interconnects: Plasticity-Amplified Diffusivity;76
7.1;Abstract;76
7.2;5.1 Introduction;76
7.3;5.2 Background;77
7.3.1;5.2.1 Dislocation Cores as Fast Diffusion Paths in Metallic Interconnects;77
7.3.2;5.2.2 Electromigration Reliability Assessment Methodology: Black's Law;79
7.4;5.3 Plasticity-Amplified Diffusion in Electromigration;80
7.4.1;5.3.1 Density of Core Dislocations ( rho core): Extent of Plasticity;81
7.4.2;5.3.2 Effect of Grain Boundary Diffusion: Effective Dcore;83
7.4.3;5.3.3 The Extra Dependency on J---The Plasticity Effect;89
7.5;5.4 Conclusions;91
7.6;References;92
8;6 Indentation Size Effects in Single Crystal Cu as Revealed by Synchrotron X-ray Microdiffraction;94
8.1;Abstract;94
8.2;6.1 Introduction;94
8.3;6.2 Background;95
8.4;6.3 Experimental;96
8.5;6.4 Results and Discussion;98
8.5.1;6.4.1 Mapping of Laue Peak Streaking on Individual Indents;98
8.5.2;6.4.2 Comparison of Laue Peak Streaking for Different Indentation Depths;100
8.5.3;6.4.3 Quantitative Analysis of Laue Peak Streaking-Based GND Density;101
8.5.4;6.4.4 Hardness Measurement and Revised Nix and Gao's GND Density;102
8.5.5;6.4.5 Strain Gradient Plasticity Analysis;103
8.6;6.5 Conclusions;106
8.7;References;106
9;7 Smaller is Stronger: Size Effects in Uniaxially Compressed Au Submicron Single Crystal Pillars;109
9.1;Abstract;109
9.2;7.1 Introduction;109
9.3;7.2 Background;110
9.4;7.3 Experimental;111
9.4.1;7.3.1 Thin Film of Au on Single Crystal Cr Substrate;111
9.4.2;7.3.2 Fabrication and Uniaxial Compression of Submicron Au Pillar;112
9.4.3;7.3.3 White-Beam X-ray Microdiffraction Experiment;113
9.5;7.4 Results and Discussion;114
9.5.1;7.4.1 Diffraction Intensity Mapping: Pillar Location Identification;114
9.5.2;7.4.2 Stress-Strain Behavior of Pillar Uniaxial Compression;116
9.5.3;7.4.3 Laue Diffraction Peak Shapes: Undeformed Versus Deformed;116
9.5.4;7.4.4 Limitation of the Technique: Quantitative Analysis of GND Density;118
9.5.5;7.4.5 Dislocation Starvation and Dislocation Nucleation-Controlled Plasticity;119
9.6;7.5 Conclusions;120
9.7;References;121
10;8 Conclusions;122
10.1;Abstract;122