Brindley Newnes Electronics Assembly Handbook

1. Auflage 2013
ISBN: 978-1-4831-0251-1
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 353 Seiten, Web PDF

Newnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes are then explained. The text also discusses surface mounted assemblies and packaging of electromechanical assemblies, as well as the soldering process. Requirements for the soldering process; solderability and protective coatings; cleaning of PCBs; and mass solder/component reflow soldering are described. The book also underscores testing for quality. Reliability, component parts testing, production processes, and the packaged and unpackaged assemblies are discussed. The text also examines standardization of electronics manufacture. Reference to standards, standards of organizations and bodies, assessed quality of companies, and setting up of company standards are considered. The book also discusses the process of selling to the Ministry of Defense. Procurement executive, quality assurance, and procurement executive policies and procedures are clarified. The handbook is a helpful reference for readers wanting to study the processes involved in electronic assembling.

Keith is a freelance journalist whose whole life (well, apart from the wife, the kids, the music and the mountain bike) is computers. He's been writing about them (computers, that is) for over 18 years, in the meantime working as a teacher, lecturer, engineer, journalist and finally (for the last 12 years) freelance in the computing field. He fondly remembers his first contacts with the Commodore Pet, the various Sinclair oddities, the BBC, PC-DOS, MS-DOS, the Mac, and the various incarnations of Windows. He dreams of new software and hardware, he realises that writing about computers makes little compared to making computers or writing the software for them, he is fully committed to passing his experience along to and making computer-life easier for his readers, yet still enjoys what he's doing. Which can't be all bad!

Autoren/Hrsg.

Brindley, Keith

Inhaltsverzeichnis

1;Front Cover;1
2;Newnes Electronics Assembly Handbook;4
3;Copyright Page;5
4;Table of Contents;6
5;Preface;8
6;Chapter 1. Introduction;10
6.1;Bringing together varied disciplines;10
6.2;Applications;11
6.3;Standardization;13
6.4;Book layout and description;14
7;Chapter 2. Electronics assembly: the PCB;15
7.1;The printed circuit board;15
7.2;Base materials;24
7.3;Basic mechanical properties;26
7.4;PCB manufacture;30
7.5;PCB manufacturing processes;38
7.6;Design;50
7.7;Layout;60
7.8;Through-hole PCB assembly;61
7.9;Testing;78
7.10;Cleaning of assemblies;78
7.11;Conformal coatings;78
7.12;Total automatic assembly;78
8;Chapter 3. Electronics assembly: the SMA;79
8.1;Surface mounted assemblies;79
8.2;Advantages and disadvantages;81
8.3;Surface mounted components;82
8.4;Base materials;90
8.5;Thermal design of surface mounted assemblies;92
8.6;Design;93
8.7;Assembly;106
8.8;Assembly variations;114
8.9;Testing assemblies;117
8.10;Component placement;117
8.11;References;128
9;Chapter 4. Electromechanical assembly: packaging;129
9.1;Packaging engineering;130
9.2;Adhesives;131
9.3;Thermal management;134
9.4;Environmental considerations;141
9.5;Electromagnetic compatability;147
9.6;References;156
10;Chapter 5. Soldering;157
10.1;Changing face;157
10.2;Requirements of the soldering process;158
10.3;Solderability and protective coatings;160
10.4;Soldering processes;163
10.5;Solder;167
10.6;Flux;173
10.7;Types of joints;175
10.8;Solder resists;183
10.9;Hand soldering;184
10.10;Mass CS soldering - wave soldering;187
10.11;Mass SC reflow soldering;195
10.12;Comparison of soldering processes;203
10.13;Cleaning of PCBs;203
10.14;References;209
11;Chapter 6. Testing for quality;210
11.1;The philosophy of quality;210
11.2;Reliability;211
11.3;Component parts testing;215
11.4;Production processes;220
11.5;The unpackaged assembly;221
11.6;The packaged assembly;226
11.7;References;227
12;Chapter 7. Standardization of electronics manufacture: quality assurance;228
12.1;Standards;228
12.2;Reference to standards;229
12.3;Levels of standards;229
12.4;Standards organizations and bodies;230
12.5;The work of BSI;233
12.6;BSS;238
12.7;Assessed capability of companies;238
12.8;Assessed quality of components;240
12.9;Setting up company standards;242
12.10;References;245
13;Chapter 8. Selling to the Ministry of Defence;246
13.1;MoD organization;246
13.2;Procurement executive;247
13.3;Procurement executive policy and procedures;251
13.4;Quality assurance;255
14;Glossary;259
15;Appendix 1: Worldwide standards;266
15.1;Guide to relevant worldwide standards, by subject;266
15.2;Guide to relevant worldwide standards, by reference;296
16;Appendix 2: Worldwide addresses;343
16.1;UK Governmental Departments;343
16.2;Institutions and associations;345
16.3;Standards organizations and bodies;346
17;Appendix 3: Further reading;350
18;Index;353