Brebbia Electrical Engineering Applications

1990
ISBN: 978-3-642-48837-5
Verlag: Springer
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, Band 7, 208 Seiten, eBook

Reihe: Topics in Boundary Element Research

The application of BEM in all fields of engineering and science has progressed at an accelerate rate since the first book on the method appeared in the late seventies. In particular the advantages of BEM for potential problems are essential to solve a whole range of electrical engineering problems. Previous volumes in this series have focussed on the state of the art in other fields while this volume discusses only problems related to electrical engineering. The book reviews a series of important applications such as the design of semiconductor devices and their thermal analysis. The following two chapters concentrate on the study of galvanic corrosion and cathodic protection. Chapter 4 deals with the design of capacitance transducers. The next three chapters concentrate on the applications of the method to simulate electrochemical problems with special reference to Plating Process. The last chapter in the book discusses the case of inverse problems in electrical engineering and presents some applications including their use in tomography.

Zielgruppe

Research

Autoren/Hrsg.

Brebbia, Carlos A.

Weitere Mitwirkende

Adey, R.A.

Aoki, S.

Brebbia, C.A.

Bullock, J.L.

Chuang, J.M.

Deconinck, J.

Mey, G. de

Giles, G.

Gray, L. J.

Hirasawa, M.

Kagawa, Y.

Kishimoto, K.

Lee, C.C.

Nakamura, M.

Niku, S.M.

Palisoc, A.L.

Zamani, N.G.

Inhaltsverzeichnis

1 Semiconductor Device Analysis.- 1.1 Introduction.- 1.2 The Basic Semiconductor Equations.- 1.3 Two Well Known Approximations.- 1.4 A Particular Application: The MOS Transistor.- 1.5 Some Further Applications.- 1.6 Conclusion.- References.- 2 Thermal Analysis of Semiconductor Devices.- 2.1 Introduction.- 2.2 Review of Previous Works.- 2.3 The Boundary Element Method.- 2.3.1 The Boundary Integral Formulation.- 2.3.2 Modeling Using the Boundary Element Method.- 2.3.3 Accuracy of the Boundary Element Method.- 2.4 Applications.- 2.4.1 Two and Three Dimensional Models of Semiconductor Devices.- 2.4.2 The Effect of Die-Bond Voids on Device Performance.- Summary.- Acknowledgement.- References.- 3 Applications of Boundary Elements in Corrosion Engineering.- 3.1 Introduction.- 3.1.1 Corrosion.- 3.2 Prediction Techniques.- 3.3 Theoretical Foundations of Cathodic Protection and Galvanic Corrosion.- 3.4 Mathematical Aspects.- 3.4.1 Numerical Solution.- 3.5 Electrode Kinetics.- 3.6 Coupling of the System.- 3.7 Polarisation.- 3.8 Systems Approach.- 3.9 Example 1: Comparison of BE Results with Cathodic Protection Experiment on a Plate.- 3.10 Example 2: Cathodic Protection of Underground Pipelines.- 3.11 Example 3: Analysis of Galvanic Corrosion (A Comparison with FE Analysis).- 3.12 Example 4: Analysis of a Galvanic Corrosion Due to a Chemical Cleaning Process.- 3.13 Example 5: Analysis of a Jacket Type Offshore Platform.- 3.14 Conclusions.- Acknowledgements.- References.- 4 Application of BEM to Galvanic Corrosion and Cathodic Protection.- 4.1 Introduction.- 4.2 Electrochemical Aspects.- 4.3 Mathematical Model.- 4.4 Boundary Element Formulation.- 4.5 Iterative Solution Procedures.- 4.6 Infinite Problems.- 4.7 Applications.- 4.7.1 Comparison with Theoretical Results.- 4.7.2 Effect of Externally Impressed Polarization.- 4.7.3 Comparison with Experimental Data.- 4.7.4 Estimation of Maximum Current Density.- 4.7.5 Three-Dimensional Problems.- 4.7.6 Infinite Problems.- 4.8 Concluding Remarks.- Acknowledgements.- References.- 5 Capacitance of Transducers for Displacement Measurement.- 5.1 Introduction.- 5.2 Calculation of Capacitance by the Boundary Element Method.- 5.2.1 Green Solution and Capacitance.- 5.2.2 Boundary Element Method.- 5.2.3 Two-Dimensional Case.- 5.2.4 Calculation of Conductance or Resistance in an Infinite Area by Ihe Boundary Element Method.- 5.3 Numerical Results.- 5.3.1 Curve of Change of Capacitance.- 5.3.2 Effect of the Gap Between the Two Electrodes.- 5.3.3 Effect of Width of Teeth.- 5.3.4 Effect of Filing a Dielectric Between Electrodes.- 5.4 Experimental Results.- 5.4.1 Experimental Equipment.- 5.4.2 Curve of Change of Capacitance.- 5.4.3 Effect of the Gap Between the Two Electrodes.- 5.4.4 Effect of Width of Teeth.- 5.5 Conclusions.- Acknowledgement.- References.- 6 Electroplating.- 6.1 Introduction.- 6.2 Mathematical Formulation.- 6.3 Boundary Element Formulation.- 6.4 Solution of the Nonlinear System.- 6.5 Development of a One-dimensional Model.- 6.6 Numerical Examples.- 6.6.1 Example 1.- 6.6.2 Example 2.- 6.6.3 Example 3.- 6.7 Conclusions.- Acknowledgement.- References.- 7 Simulation of an Electrochemical Plating Process.- 7.1 Introduction.- 7.2 Equations.- 7.3 Boundary Element Method.- 7.4 Experiment.- 7.4.1 Plating Cell.- 7.4.2 Tank Discretization.- 7.4.3 Node Movement.- 7.4.4 Parameters.- 7.5 Results.- 7.6 Conclusions.- Acknowledgements.- References.- 8 Electrochemical Cell Design.- 8.1 Introduction.- 8.2 Fundamental Equations.- 8.2.1 Transport of Charge.- 8.2.2 Transport of Mass.- 8.3 Boundary Conditions.- 8.3.1 Insulators.- 8.3.2 Electrodes.- 8.3.2.1 Electrode Reactions.- 8.3.2.2 Resistances Involved by Coatings.- 8.3.2.3 Concentration Overpotentials.- 8.3.2.4 Resistive Electrodes.- 8.4 Types of Distributions, the Wagner Number.- 8.5 Electrode Shape Change and Moving Boundaries.- 8.6 Solution of the Potential Model.- 8.6.1 Discretization of the BEM.- 8.6.1.1 Two-Dimensional Problems.- 8.6.1.2 Axìsymmetrical Problems.- 8.6.2 Solution of the Non-linear System.- 8.6.3 Solution of Resistive Electrodes.- 8.6.4 Repetitive Geometries.- 8.6.5 Examples.- 8.6.6 Comparison with Measurements.- 8.7 Solution of Electrode Shape Changes.- 8.7.1 Discretization with Respect to Time.- 8.7.1.1 Electrode Shape Change Next to an Insulator.- 8.7.1.2 Electrochemical Machining.- 8.7.2 Examples.- 8.7.3 Comparison with Measurements.- References.- 9 Inverse Problems and Some Applications.- 9.1 Introduction.- 9.2 Fields of Application of Inverse Problems.- 9.3 Application of Boundary Element Methods.- 9.4 Numerical Simulation.- 9.4.1 The Inverse Electrocardiography Problem.- 9.4.1.1 Fundamentals of an Electrocardiogram.- 9.4.1.2 Boundary Element Model.- 9.4.1.3 Numerical Experiments.- 9.4.1.4 On Ill-Conditioning and Regularization Problems.- 9.4.2 Boundary Determination in Impedance Plethysmography.- 9.4.2.1 On Impedance CT and Plethysmography.- 9.4.2.2 Influence Coefficient Approach and Lead Theory Approach.- 9.4.2.3 Numerical Experiments.- 9.4.2.4 Some Mathematical Background.- 9.4.2.5 Other Approaches and Applications.- 9.5 Improvement of the Boundary Determination Capability.- 9.5.1 Efficiency and Convergence.- 9.5.2. Boundary Determination Based on Dual Complementary Formulation.- 9.5.2.1 Lead Theory in Single Medium Field.- 9.5.2.2 Dual and Complementary Expressions.- 9.5.2.3 Boundary Element Discretization.- 9.5.3 Dual and Complementary Energy Expressions.- 9.5.4 Numerical Simulation.- 9.5.4.1 Electric Potential-nondestructive Testing.- 9.5.4.2 Impedance Plethysmography.- References.