Buch, Englisch, Band 9, 152 Seiten, Paperback, Format (B × H): 160 mm x 240 mm, Gewicht: 286 g
Buch, Englisch, Band 9, 152 Seiten, Paperback, Format (B × H): 160 mm x 240 mm, Gewicht: 286 g
Reihe: Current Issues in Electronic Modeling
ISBN: 978-1-4613-7890-7
Verlag: Springer US
The first part of the book considers system level design, discussing such issues as abstraction, performance and trade-offs. There is also a section on automating system design. The second part of the book deals with some of the newest aspects of embedded system design. These include co-verification and prototyping. Finally, the book includes a section on the use of the MCSE methodology for hardware/software co-design.
will help designers and researchers to understand these latest techniques in system design and as such will be of interest to all involved in embedded system design.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Mathematik | Informatik EDV | Informatik Informatik Mathematik für Informatiker
- Technische Wissenschaften Energietechnik | Elektrotechnik Elektrotechnik
- Mathematik | Informatik EDV | Informatik Professionelle Anwendung Computer-Aided Design (CAD)
- Technische Wissenschaften Technik Allgemein Technik: Allgemeines
- Mathematik | Informatik EDV | Informatik Programmierung | Softwareentwicklung Software Engineering
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
Weitere Infos & Material
1. Modeling And Synthesis Of Synchronous System-Level Specifications.- 1.1. Introduction.- 1.2. System-Level Designs.- 1.3. Modeling of Concurrent Synchronous Systems.- 1.4. Semantics of CFEs.- 1.5. Scheduling Operations in CFFSM.- 1.6. Experimental Results.- 1.7. Conclusions and Future Work.- 2. System Level Modeling And Hardware Architecture Trade-Off.- 2.1. Introduction.- 2.2. Modelling and Abstraction.- 2.3. Hardware Architecture Trade-Off.- 2.4. Behavior Modeling.- 2.5. Additional Reuse Aspects.- 2.6. Conclusion.- 3. Automating System Design With Conceptual Models.- 3.1. Introduction.- 3.2. Conceptual Graphs.- 3.3. Requirements Capture.- 3.4. Unification of Requirements.- 3.5. Design Knowledge.- 3.6. Analysis of Specifications.- 3.7. Model Generation.- 3.8. Back-Annotation.- 3.9. Conclusions.- 4. Hardware/Software Co-Verification Of Embedded System Designs Using Virtual System Integration.- 4.1. Introduction.- 4.2. Current State of Affairs.- 4.3. New Unified Integration Environment.- 4.4. Benefits of Virtual System Integration.- 4.5. Conclusion.- 5. LIRMM: Prototyping Platform For Hardware/Software Codesign.- 5.1. Introduction.- 5.2. Hardware/Software Codesign Environment.- 5.3. Prototyping Board Architecture.- 5.4. Prototyping Board Performance.- 5.5. Application.- 5.6. Conclusion.- 6. Hardware/Software System Design Based On The MCSE Methodology.- 6.1. Introduction.- 6.2. Overview of the Codesign Methodology.- 6.3. Presentation of the Example.- 6.4. Functional Design with Performance Mastering.- 6.5. Implementation Specification Step.- 6.6. An Example of Codesign Problems.- 6.7. Conclusions.