Semiconductor Product Engineering, Quality and Operations

Deliver High Quality Products & Increase Profits
1. Auflage 2022
ISBN: 978-3-031-18032-3
Verlag: Springer International Publishing

Buch, Englisch, 90 Seiten, Format (B × H): 168 mm x 240 mm, Gewicht: 236 g

Reihe: Synthesis Lectures on Engineering, Science, and Technology

This book captures the author’s 35+ years of learning & experience in the semiconductor chip industry to provide a proven roadmap for successful, new product introduction process, tailored specifically to the semiconductor industry. The content includes a simplified process flow, success metrics, execution guidelines, checklists & calculators. The presentation is based on a product engineering centric “NPI hub” and the author guides readers through the complete process of semiconductor new product introduction, ensuring a successful plan execution.

Zielgruppe

Professional/practitioner

Autoren/Hrsg.

Barman, Fariborz

Fachgebiete

• Technische Wissenschaften Technik Allgemein Konstruktionslehre und -technik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau Konstruktionslehre, Bauelemente, CAD
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Verfahrenstechnik, Chemieingenieurwesen

Inhaltsverzeichnis

Introduction.- Overall Picture of Product Development stages & where product engineers add value.- Get to know your products(s) intimately.- Put your reliability qualification plan & schedule together.- Put your characterization plans & schedule together.- Engineering Sample Phase.- Process Skew Lots (Assess Yield Variations, Yield pitfalls).- Assess your products’ Reliability using industry standard specifications.- Analysis of failures to root cause is the key to a robust product.- Get ready for Production Silicon.- Compliance to Industry & Customer Standards.- Ring out the kinks in your manufacturing flow early.- Enable your manufacturing sites.- Start looking at cost reduction & manufacturing simplification.- Finance - Budgeting for char., rel. qual, boards etc.

Über Autor(innen)

A little bit about me. My college degrees include BS & MS in Computer Engineering both from University of California. I have been in the semiconductor industry since 1984 fulfilling several different roles with increasing complexity and responsibility as my skills & experience grew. 

My first job was a process development engineer involved in the 1 to 2 um CMOS technologies. My most recent position has involved board level product management & operations. In the early days of my career I was developing transistors & memory cells (i.e the building blocks of every semiconductor product). Later on I was responsible for model parameter extractions which were the building blocks of SPICE transistor model developments. During the latter half of my career I became interested in product & test engineering. So I used my knowledge of basics to move my career in that direction. More recently I have managed new product introductions for several types of products including ASICs, FPGA & mixed signal products.