Advances in Cryogenic Engineering

Transactions of the International Cryogenic Materials Conference - ICMC. Volume 50
1. Auflage 2004
ISBN: 978-0-7354-0187-7
Verlag: AIP Press

Medienkombination, Englisch, Band 711, 928 Seiten, mit 1 CD-ROM, Format (B × H): 170 mm x 244 mm, Gewicht: 2140 g

Reihe: AIP Conference Proceedings

The International Cryogenic Materials Conference covers cryogenic magnetic materials, structural materials, non-metallic materials, materials testing, mechanical properties of materials used in cryogenic applications, and low, high, and intermediate -temperature superconductors. Detailed room and low temperature properties of cryogenic functional materials, physical and mechanical properties of metallic and non-metallic materials and performance of insulation materials upon irradiation are provided in this Proceedings. Processing, fabrication, and electromagnetic properties of conventional low-temperature, high-temperature, and magnesium diboride superconductors are also presented.

Topics include: cryogenic functional materials; cryogenic materials testing; physical and mechanical properties at cryogenic temperatures; non-metallic materials-properties; non-metallic materials-insulation; Nb-Ti conductors; Nb3Sn conductors; Nb3Al conductors; MgB2 conductors; HTS bulk conductors; BSCCO conductors; HTS coated conductors; HTS electronics and thin film; stability and AC loss; HTS prototype devices; and HTS stability and training of magnets.

Zielgruppe

Research

Autoren/Hrsg.

Balachandran, U. (Balu)

Fachgebiete

• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Keramik- und Glastechnologie
• Naturwissenschaften Physik Elektromagnetismus Halbleiter- und Supraleiterphysik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Keramik, Glas, Sonstige Werkstoffe