Buch, Englisch, Band 66, 266 Seiten, Format (B × H): 164 mm x 242 mm, Gewicht: 1250 g
Buch, Englisch, Band 66, 266 Seiten, Format (B × H): 164 mm x 242 mm, Gewicht: 1250 g
Reihe: Lecture Notes in Electrical Engineering
ISBN: 978-90-481-9378-3
Verlag: Springer
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Schaltungsentwurf
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien
Weitere Infos & Material
Synergy Between Design and Technology: A Key Factor in the Evolving Microelectronic Landscape.- EMERGING TECHNOLOGY AND DEVICES.- New State Variable Opportunities Beyond CMOS: A System Perspective.- A Simple Compact Model to Analyze the Impact of Ballistic and Quasi-Ballistic Transport on Ring Oscillator Performance.- ADVANCED DEVICES AND CIRUITS.- Low-Voltage Scaled 6T FinFET SRAM Cells.- Independent-Double-Gate FINFET SRAM Cell for Drastic Leakage Current Reduction.- Metal Gate Effects on a 32 nm Metal Gate Resistor.- RELIABILITY AND SEU.- Threshold Voltage Shift Instability Induced by Plasma Charging Damage in MOSFETS with High-K Dielectric.- Analysis of SI Substrate Damage Induced by Inductively Coupled Plasma Reactor with Various Superposed Bias Frequencies.- POWER, TIMING AND VARIABILITY.- CMOS SOI Technology for WPAN: Application to 60 GHZ LNA.- SRAM Memory Cell Leakage Reduction Design Techniques in 65 nm Low Power PD-SOI CMOS.- Resilient Circuits for Dynamic Variation Tolerance.- Process Variability-Induced Timing Failures – A Challenge in Nanometer CMOS Low-Power Design.- How Does Inverse Temperature Dependence Affect Timing Sign-Off.- CMOS Logic Gates Leakage Modeling Under Statistical Process Variations.- On-Chip Circuit Technique for Measuring Jitter and Skew with Picosecond Resolution.- ANALOG AND MIXED SIGNAL.- DC–DC Converter Technologies for On-Chip Distributed Power Supply Systems – 3D Stacking and Hybrid Operation.- Sampled Analog Signal Processing: From Software-Defined to Software Radio.
