Buch, Englisch, 244 Seiten, Format (B × H): 178 mm x 254 mm, Gewicht: 489 g
Reihe: IFI Data Base Library
A Bibliography
Buch, Englisch, 244 Seiten, Format (B × H): 178 mm x 254 mm, Gewicht: 489 g
Reihe: IFI Data Base Library
ISBN: 978-1-4684-6107-7
Verlag: Springer US
Microelectronic packaging protects and supports electronic devices and circuits and provides connections to the other parts of the system. The protection function avoids mechanical, electrical, chemical, contamination, and photo-optical damage, degeneration, and causes of malfunction. Hybrid microelectronic circuits and subsystem packages support the substrates; the substrate contains the circuit elements, (semiconductor devices or IC chips, deposited or chip resistors and capacitors, and attached inductors), as well as deposited and bonded interconnection wires. The connections to other parts of the system include electrical leads, heat removal paths, and mounting functions. At present, in order to meet the demands of VLSI, the emphasis is on packages with higher densities while maintaining performance, reliability, and low cost. This book is a comprehensive bibliography of over 3000 refer ences of the world literature in microelectronic packaging. It is compiled to assist the workers in the field in comparing their work with that done by others. For easy access to the needed references, the book is divided into many sections and subsections (see Contents). A comprehensive subject index is also given to assure easy access to the needed data. The book cites a number of books and review articles for the beginner in the field who wishes to become familiar with the subject. Novel technologies, such as bubble domain and multilayer ceramic packaging are highlighted. The literature from January 1976 to December 1978 is covered.
Zielgruppe
Research
Autoren/Hrsg.
Weitere Infos & Material
I. Bibliographies.- II. Books.- III. Review Articles.- IV. Bonding Techniques.- 1. General.- 2. Adhesive.- 3. Beam-Lead.- 4. Chip Joining.- 5. Metal-Ceramic Seals.- 6. Metal-Glass Seals.- 7. Soldering.- 8. Thermocompression.- 9. Ultrasonic.- 10. Welding/Brazing.- 11. Others.- V. Interconnections.- 1. Single Layer.- 2. Multilayer.- VI. Metallized Ceramics.- VII. Encapsulation.- VIII. Hermeticity.- IX. Resistors.- X. Capacitors.- XI. Epdxies.- XII. Screens, Pastes, and Inks.- XIII. Coating/Passivation.- XIV. Plating.- XV. Electron Beam Techniques.- XVI. Laser Techniques.- 1. Resistor Trimming.- 2. Hole Drilling.- 3. Others.- XVII. Package Design.- 1. Computer-Aided Design (CAD).- 2. Others.- XVIII. Thermal Design.- 1. Cooling.- 2. Heat Sinks/Heat Pipes.- 3. Thermal Analysis.- XIX. Fabrication Techniques.- XX. Repair/Rework.- XXI. Types of Packages.- 1. Bubble Domain.- 2. Ceramic.- 3. Hybrid.- 4. Microwave.- 5. Multilayer Ceramic.- 6. Optoelectronic.- 7. Polyimide.- 8. Others.- XXII. Reliability.- 1. General.- 2. Bond Failure.- 3. Circuitry Failure.- 4. Encapsulation Failure.- 5. Contamination and Cleaning.- 6. Others.- XXIII. Testing.- 1. Accelerated Life Test.- 2. Boards/Cards.- 3. Bonds.- 4. Coatings.- 5. Integrated Circuits.- 6. Substrates.- 7. Others.- XXIV. Automation.- XXV. Equipment and Tooling.- XXVI. Cost and Yield.- XXVII. Future Trends.
