Microchip Fabrication

A Practical Guide to Semiconductor Processing, Sixth Edition: A Practical Guide to Semiconductor Processing
6. Auflage 2014
ISBN: 978-0-07-182101-8
Verlag: McGraw-Hill Education

Buch, Englisch, 576 Seiten, Format (B × H): 196 mm x 241 mm, Gewicht: 1255 g

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The most complete, current guide to semiconductor processingFully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.COVERAGE INCLUDES: - The semiconductor industry
- Properties of semiconductor materials and chemicals
- Crystal growth and silicon wafer preparation
- Wafer fabrication and packaging
- Contamination control
- Productivity and process yields
- Oxidation
- The ten-step patterning process--surface preparation to exposure; developing to final inspection
- Next generation lithography
- Doping
- Layer deposition
- Metallization
- Process and device evaluation
- The business of wafer fabrication
- Devices and integrated circuit formation
- Integrated circuits
- Packaging

Autoren/Hrsg.

Zant, Peter Van

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie

Inhaltsverzeichnis

Ch 1. The Semiconductor Industry
Ch 2. Properties of Semiconductor Materials and Chemicals
Ch 3. Crystal Growth and Silicon Wafer Preparation
Ch 4. Overview of Wafer Fabrication
Ch 5. Contamination Control
Ch 6. Productivity and Process Yields
Ch 7. Oxidation
Ch 8. The Ten-Step Patterning Process--Surface Preparation to Exposure
Ch 9. The Ten-Step Patterning Process--Developing to Final Inspection
Ch 10. Advanced Photolithography Processes
Ch 11. Doping
Ch 12. Layer Deposition
Ch 13. Metalization
Ch 14. Process and Device Evaluation
Ch 15. The Business of Water Fabrication
Ch 16. Introduction to Device and Integrated Circuit Formation
Ch 17. Introduction to Integrated Circuits
Ch 18. Packaging
Glossary
Index

Über Autor(innen)

Zant, Peter Van
Peter Van Zant is the Principal of Peter Van Zant Associates, a semiconductor manufacturing consulting and training company, and the author of all three previous editions of this widely read book. He has over 35 years in the semiconductor industry, working at IBM, Texas Instruments, and National Semiconductors. He resides in Grass Valley, California.

Peter Van Zant is an internationally known semiconductor professional with an extensive background in process engineering, training, consulting, and writing. He is the principal of Peter Van Zant Associates, a firm that supplies writing, training, and consulting services to business and industry. Van Zant’s books and training materials are used by chip manufacturers, industry suppliers, colleges, and universities. Peter Van Zant Associates' customers have included Intel, National Semiconductor, Applied Materials, Air Products and Chemicals, SCP Global Inc., and a number of educational institutions.