Solid-State Imaging with Charge-Coupled Devices

1995
ISBN: 978-0-7923-3456-9
Verlag: Springer Netherlands

Buch, Englisch, Band 1, 390 Seiten, HC runder Rücken kaschiert, Format (B × H): 160 mm x 241 mm, Gewicht: 1690 g

Reihe: Solid-State Science and Technology Library

Solid-State Imaging with Charge-Coupled Devices covers the complete imaging chain: from the CCD's fundamentals to the applications. The book is divided into four main parts: the first deals with the basics of the charge-coupled devices in general. The second explains the imaging concepts in close relation to the classical television application. Part three goes into detail on new developments in the solid-state imaging world (light sensitivity, noise, device architectures), and part four rounds off the discussion with a variety of applications and the imager technology.
The book is a reference work intended for all who deal with one or more aspects of solid- state imaging: the educational, scientific and industrial world. Graduates, undergraduates, engineers and technicians interested in the physics of solid-state imagers will find the answers to their imaging questions. Since each chapter concludes with a short section `Worth Memorizing', reading this short summary allows readers to continue their reading without missing the main message from the previous section.

Zielgruppe

Research

Autoren/Hrsg.

Theuwissen, A. J.

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
• Naturwissenschaften Physik Thermodynamik Festkörperphysik, Kondensierte Materie
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
• Medizin | Veterinärmedizin Medizin | Public Health | Pharmazie | Zahnmedizin Medizinische Fachgebiete Bildgebende Verfahren, Nuklearmedizin, Strahlentherapie Radiologie, Bildgebende Verfahren
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Verbundwerkstoffe

Inhaltsverzeichnis

Fundamentals of Charge-Coupled Devices.- Into, Through and Out of a Charge-Coupled Device.- A Real CCD Delay Line.- Solid-State Imaging at a Glance.- Fundamentals of Solid-State Imaging.- Solid-State Imaging for Television Applications.- Advance Imaging: Light Sensitivity.- Advanced Imaging: Noise and Smear.- Advanced Imaging: Device Architectures.- Nonconsumer Imaging.