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Moisture Sensitivity of Plastic Packages of IC Devices

  • Book
  • © 2010

Overview

Editors:
  1. X.J. Fan

    1. Dept. Mechanical Engineering, Lamar University, Beaumont, USA

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  2. E. Suhir

    1. ERS Co., Los Altos, USA

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    You can also search for this editor in PubMed   Google Scholar

  • Presented in a systematic manner based on lectures and tutorials by the authors
  • Focused on improved reliability in plastic packaging
  • Provides theory and new industry applications
  • Includes supplementary material: sn.pub/extras

  • 56k Accesses

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About this book

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

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Table of contents (21 chapters)

  1. Front Matter

    Pages i-xvii
    Download chapter PDF

  2. Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-Induced Damages in Polymeric Materials in Electronic Packaging

    • X. J. Fan, S.W.R. Lee
    Pages 1-28

  3. Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds

    • M. H. Shirangi, B. Michel
    Pages 29-69

  4. Real-Time Characterization of Moisture Absorption and Desorption

    • Y. He, X.J. Fan
    Pages 71-89

  5. Modeling of Moisture Diffusion and Whole-Field Vapor Pressure in Plastic Packages of IC Devices

    • X. J. Fan, T.Y. Tee, X.Q. Shi, B. Xie
    Pages 91-112

  6. Characterization of Hygroscopic Deformations by Moiré Interferometry

    • E. Stellrecht, B. Han, M. Pecht
    Pages 113-130

  7. Characterization of Interfacial Hydrothermal Strength of Sandwiched Assembly Using Photomechanics Measurement Techniques

    • X. Q. Shi, X.J. Fan, Y.L. Zhang, W. Zhou
    Pages 131-151

  8. Hygroscopic Swelling of Polymeric Materials in Electronic Packaging: Characterization and Analysis

    • J. Zhou, T.Y. Tee, X.J. Fan
    Pages 153-179

  9. Modeling of Moisture Diffusion and Moisture-Induced Stresses in Semiconductor and MEMS Packages

    • C. Jang, B. Han
    Pages 181-219

  10. Methodology for Integrated Vapor Pressure, Hygroswelling, and Thermo-mechanical Stress Modeling of IC Packages

    • T.Y. Tee
    Pages 221-243

  11. Failure Criterion for Moisture-Sensitive Plastic Packages of Integrated Circuit (IC) Devices: Application and Extension of the Theory of Thin Plates of Large Deflections

    • E. Suhir, X.J. Fan
    Pages 245-278

  12. Continuum Theory in Moisture-Induced Failures of Encapsulated IC Devices

    • X.J. Fan, J. Zhou, G.Q. Zhang, A. Chandra
    Pages 279-299

  13. Mechanism-Based Modeling of Thermal- and Moisture-Induced Failure of IC Devices

    • H.B. Chew, T.F. Guo, L. Cheng
    Pages 301-331

  14. New Method for Equivalent Acceleration of IPC/JEDEC Moisture Sensitivity Levels

    • B. Xie, X.J. Fan, X.Q. Shi
    Pages 333-358

  15. Moisture Sensitivity Level (MSL) Capability of Plastic-Encapsulated Packages

    • J.K. Fauty
    Pages 359-388

  16. Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages

    • M.S. Zhang, S.W.R. Lee, X.J. Fan
    Pages 389-409

  17. Industrial Applications of Moisture-Related Reliability Problems

    • W.D. van Driel, D.G. Yang, C.A. Yuan, G.Q. Zhang
    Pages 411-434

  18. Underfill Selection Against Moisture in Flip Chip BGA Packages

    • X.J. Fan, T.Y. Tee, C.Q. Cui, G.Q. Zhang
    Pages 435-460

  19. Moisture Sensitivity Investigations of 3D Stacked-Die Chip-Scale Packages (SCSPs)

    • X.Q. Shi, X.J. Fan, B. Xie
    Pages 461-478

  20. Automated Simulation System of Moisture Diffusion and Hygrothermal Stress for Microelectronic Packaging

    • Y. Liu
    Pages 479-501
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Editors and Affiliations

  • Dept. Mechanical Engineering, Lamar University, Beaumont, USA

    X.J. Fan

  • ERS Co., Los Altos, USA

    E. Suhir

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