Handbook of Semiconductor Manufacturing Technology

2. New Auflage 2007
ISBN: 978-1-57444-675-3
Verlag: Taylor & Francis Inc

Buch, Englisch, 1720 Seiten, Format (B × H): 189 mm x 264 mm, Gewicht: 1951 g

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available.

Stay Current with the Latest Technologies
In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on…
- Silicon-on-insulator (SOI) materials and devices

- Supercritical CO2 in semiconductor cleaning

- Low-? dielectrics

- Atomic-layer deposition

- Damascene copper electroplating

- Effects of terrestrial radiation on integrated circuits (ICs)

Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication.

While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Zielgruppe

Professional

Autoren/Hrsg.

Nishi, Yoshio

Doering, Robert

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie

Inhaltsverzeichnis

Introduction to Semiconductor Devices. Overview of Interconnect-Copper and Low-? Integration. Silicon Materials. SOI Materials and Devices. Surface Preparation. Supercritical Carbon Dioxide in Semiconductor Cleaning. Ion Implantation. Dopant Diffusion. Oxidation and Gate Dielectrics. Silicides. Rapid Thermal Processing. Low-? Dielectrics. Chemical Vapor Deposition. Atomic Layer Deposition. Physical Vapor Deposition. Damascene Copper Electroplating. Chemical-Mechanical Polishing. Optical Lithography. Photoresist Materials and Processing. Photomask Fabrication. Plasma Etch. Equipment Reliability. Overview of Process Control. In-Line Metrology. In-Situ Metrology. Yield Modeling. Yield Management. Electrical, Physical, and Chemical Characterization. Failure Analysis. Reliability Physics. Effects of Terrestrial Radiation on Integrated Circuits. Integrated-Circuit Packaging. 300 mm Wafer Fab Logistics and Automated Material Handling Systems. Factory Modeling. Economics of Semiconductor Manufacturing. Appendix A: Physical Constants. Appendix B: Units Conversion. Appendix C: Standards Commonly Used in Semiconductor Manufacturing. Appendix D: Acronyms. Index.

Über Autor(innen)

Nishi, Yoshio; Doering, Robert