Thermal Contact Conductance

1. Auflage 2011
ISBN: 978-1-4612-8457-4
Verlag: Springer-Verlag New York

Buch, Englisch, 168 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 288 g

Reihe: Mechanical Engineering Series

Heat transfer between two bodies in thermal contact is of fundamental importance in a wide variety of applications ranging from industrial and domestic processes to fundamental biology and chemistry. This book covers both the theoretical and practical aspects of thermal contact conductance. The theoretical discussion covers heat transfer through spots, joints, and surfaces, as well as the role of interstitial materials (both planned and inadvertent). The practical discussion includes formulae and data for use in designing heat-transfer equipment for a variety of joints, including special geometries and configurations.

Zielgruppe

Research

Autoren/Hrsg.

Madhusudana, C.V.

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Technische Thermodynamik
• Naturwissenschaften Physik Thermodynamik
• Naturwissenschaften Physik Angewandte Physik

Inhaltsverzeichnis

Contents: Introduction.- Thermal Constriction Resistance.- Solid Spot Thermal Conductance of a Joint.- Gas Gap Conductance.