Le | Physical Layer Security | Buch | 978-3-030-55365-4 | sack.de

Buch, Englisch, 186 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 506 g

Le

Physical Layer Security


1. Auflage 2021
ISBN: 978-3-030-55365-4
Verlag: Springer International Publishing

Buch, Englisch, 186 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 506 g

ISBN: 978-3-030-55365-4
Verlag: Springer International Publishing


This book studies the vulnerability of wireless communications under line-of-sight (LoS) and non-LoS correlated fading environments. The authors theoretically and practically provide physical layer security analyses for several technologies and networks such as Fifth-Generation (5G) networks, Internet of Things (IoT) applications, and Non-orthogonal multiple access (NOMA). The authors have provided these under various practical scenarios, and developed theoretical aspects to validate their proposed applications.

- Presents physical layer security (PLS) under correlated fading environments, 5G wireless networks, and NOMA networks;
- Provides end-to-end analyses, combination of channel correlation and outdated CSI and their effects on PL;
- Includes contributions of PLS research written by global experts in academia and industry.

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Zielgruppe


Research


Autoren/Hrsg.


Weitere Infos & Material


Chapter 1. Physical Layer Security in Hybrid Satellite-Terrestrial Relay Networks.- Chapter 2. Secure Transmission with Directional Modulation Based on Random Frequency Diverse Arrays.- Chapter 3. Physical Layer Security in Cache-Enabled Heterogeneous Cellular Networks.- Chapter 4. Backash Light as a Security Vulnerability in Quantum Key Distribution Systems.- Chapter 5. Cooperative Physical Layer Secret Key Generation by Virtual Link Estimation.- Chapter 6. Physical Layer Security: Authentication, Integrity and Con dentiality.- Chapter 7. Secure Device Pairing Protocol Based on Wireless Channel Characteristics for Body Area Networks.


Khoa N. LE received his Ph.D. from Monash University (Victoria, Australia) in Signal Processing and Telecommunications. He is co-founder of Ecobond Pty Ltd in addition to an Honorary Professor performing research on wireless communications at Posts and Telecommunications Institute of Technology, Vietnam. He was previously a Senior Lecturer and Head of Program at Western Sydney University, Australia; Visiting Professor, University of Technology Malaysia, among other positions. He has presented at global conferences, receiving many awards including best paper, top publication prize, among others. He has edited and contributed to several publications and published dozens of journal articles. He is currently Editor for the IEEE Transactions on Vehicular Technology, and IEEE Wireless Communications Magazine, and IET Signal Processing.



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