CMOS VLSI Engineering

Silicon-on-Insulator (SOI)
1998
ISBN: 978-0-7923-8272-0
Verlag: Springer US

Buch, Englisch, 422 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1830 g

Silicon-On-Insulator (SOI) CMOS technology has been regarded as another major technology for VLSI in addition to bulk CMOS technology. Owing to the buried oxide structure, SOI technology offers superior CMOS devices with higher speed, high density, and reduced second order effects for deep-submicron low-voltage, low-power VLSI circuits applications. In addition to VLSI applications, and because of its outstanding properties, SOI technology has been used to realize communication circuits, microwave devices, BICMOS devices, and even fiber optics applications.
addresses three key factors in engineering SOI CMOS VLSI - processing technology, device modelling, and circuit designs are all covered with their mutual interactions. Starting from the SOI CMOS processing technology and the SOI CMOS digital and analog circuits, behaviors of the SOI CMOS devices are presented, followed by a CAD program, ST-SPICE, which incorporates models for deep-submicron fully-depleted mesa-isolated SOI CMOS devices and special purpose SOI devices including polysilicon TFTs.
is written for undergraduate senior students and first-year graduate students interested in CMOS VLSI. It will also be suitable for electrical engineering professionals interested in microelectronics.

Zielgruppe

Research

Autoren/Hrsg.

Kuo, James B.

Fachgebiete

• Mathematik | Informatik EDV | Informatik Informatik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise

Inhaltsverzeichnis

1 Introduction.- 2 SOI CMOS Technology.- 3 SOI CMOS Circuits.- 4 SOI CMOS Devices—Basic.- 5 SOI CMOS Devices—Advanced.- 6 SOI-Technology ST-SPICE.- 7 Special-Purpose SOI.