A Guide to Lead-Free Solders

Physical Metallurgy and Reliability
2007. Auflage 2006
ISBN: 978-1-84628-309-3
Verlag: Springer

Buch, Englisch, 206 Seiten, Format (B × H): 163 mm x 239 mm, Gewicht: 1080 g

The transition to lead-free solders seems to be a foregone conclusion with Japan and Europe leading the way. Indeed some key companies will move to lead free soon and the WEEE Directive 2002/96/EC on Waste Electrical and Electronic Equipment will require all companies doing business in the EU to transition to lead-free. Compliance with forthcoming lead-free regulations will ultimately fall to individual companies and the engineers responsible for design and prod- tion of electronic products and they must be prepared with adequate knowledge of the materials that are leading candidates and they must be prepared to fill the gaps in the data base for their own products. Research worldwide over the past 10 years has produced data and direction for choosing an alloy to substitute for near-eutectic SnPb alloys. This book will provide a valuable resource for engineers involved in the transition to products. Basic theory is presented on the physical metallurgy of soldering technology including elements of assembly, surface finishes and solder-paste technology, wetting and solidification, microstructural instability and intermetallic c- pounds and mechanical, creep and fatigue behavior. Techniques for measuring and testing are discussed and data on SnPb and various lead-free solders are presented and compared. If lead-free solder data are not available on the re- vant topic, information is presented on near-eutectic SnPb, so as to show where the gaps in knowledge need to be filled.

Zielgruppe

Professional/practitioner

Autoren/Hrsg.

Evans, John W

Engelmaier, Werner

Weitere Mitwirkende

Kwon, Dong-il

Fachgebiete

• Technische Wissenschaften Sonstige Technologien | Angewandte Technik Bergbau, Hüttenwesen
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau
• Technische Wissenschaften Technik Allgemein Technische Zuverlässigkeit, Sicherheitstechnik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Werkzeugbau
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Verbundwerkstoffe
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Metallische Werkstoffe
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Industrielle Qualitätskontrolle
• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Metallurgie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik

Inhaltsverzeichnis

to Solder Alloys and Their Properties.- Packaging Architecture and Assembly Technology.- Wetting and Joint Formation.- Microstructural Instability in Solders.- Intermetallic Formation and Growth.- Mechanical Properties and Creep Behavior.- Thermomechanical Fatigue.- Product Assurance.