Coekin / Hammond High-Speed Pulse Techniques

1. Auflage 2013
ISBN: 978-1-4831-0548-2
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 232 Seiten, Web PDF

High-Speed Pulse Techniques covers the many aspects of technique in digital electronics and encompass some of the more fundamental factors that apply to all digital systems. The book describes the nature of pulse signals and their deliberate or inadvertent processing in networks, transmission lines and transformers, and then examines the characteristics and transient performance of semiconductor devices and integrated circuits. Some of the problems associated with the assembly of these into viable systems operating at ultra high speed are also looked at. The book examines the transients and waveshaping in linear circuits; the steady-state and transient characteristics of the diode switch; and the two most useful diode waveshaping functions, clipping and clamping circuits. The characteristics of distributed-parameter transmission lines with and without losses and their implications in digital systems are also considered. The book then tackles transformer pulse response; bipolar and unipolar transistor transient response; and the characteristics of subnanosecond switching diodes and of high-speed logic. The text describes the implementation of high-speed systems as well. Students and practicing electronics and computer systems engineers will find the book useful.

Autoren/Hrsg.

Coekin, J. A.

Hammond, P.

Inhaltsverzeichnis

1;Front Cover;1
2;High-Speed Pulse Techniques;4
3;Copyright Page;5
4;Table of Contents;6
5;Preface;10
6;CHAPTER 1. The Time and Frequency Domains;14
6.1;1.1. Introduction;14
6.2;1.2. The Nomenclature of Pulse Techniques;15
6.3;1.3. Pulse Spectra;17
6.4;1.4. Problems;29
6.5;1.5. References;30
6.6;1.6. Bibliography;30
7;CHAPTER 2. Transients and Waveshaping in Linear Circuits;31
7.1;2.1. Basic Principles;32
7.2;2.2. High-Pass Circuit Model;34
7.3;2.3· The Low-Pass Circuit Model;38
7.4;2.4. Exponential Inputs—Cascaded Circuits;41
7.5;2.5. Attenuators;43
7.6;2.6. RLC Circuits;45
7.7;2.7. Problems;49
7.8;2.8. References;50
8;CHAPTER 3. The Practical Diode Switch;51
8.1;3.1. Steady-State Characteristics;51
8.2;3.2. Integrated Transistors as Diodes3·5;54
8.3;3.3. Transient Characteristics;55
8.4;3.4. Charge Control Calculations;58
8.5;3.5. Some Practical Diodes;59
8.6;3.6. The Schottky Barrier (Hot Carrier) Diode;59
8.7;3.7. Reducing Charge Storage Time;62
8.8;3.8. Problems;64
8.9;3.9· References;65
9;CHAPTER 4. Diode Clipping and Clamping Circuits;67
9.1;4.1. Transfer Characteristics and Clipping;68
9.2;4.2. Clipping and Pick-Off Circuits;70
9.3;4.3. Clamping and DC Restoration;73
9.4;4.4. Problems;77
10;CHAPTER 5. Pulses on Transmission Lines;79
10.1;5.1. Transmission Line Types and Parameters;80
10.2;5.2. Matching and Reflections;83
10.3;5.3. Inductive and Capacitive Terminations;87
10.4;5.4. Losses;89
10.5;5.5. Coaxial Cable Response;91
10.6;5.6. Microstrip;95
10.7;5.7. Non-Uniform Lines;97
10.8;5.8. Pulse Generation and Shaping;98
10.9;5.9. Problems;100
10.10;5.10. References;101
11;CHAPTER 6. Pulse Transformers;103
11.1;6.1. Equivalent Circuits;103
11.2;6.2. Rise Time Response;105
11.3;6.3. Pulse Top Transmission;108
11.4;6.4. Trailing Edge Response;109
11.5;6.5. Nonlinear Source and Load Resistance;111
11.6;6.6. Effects of Core Materials and Geometry;112
11.7;6.7. Transmission Line Transformers;113
11.8;6.8. Design Procedures;116
11.9;6.9. Problems;118
11.10;6.10. References;119
12;CHAPTER 7. Bipolar and Unipolar Transistor Transient Response;120
12.1;7.1. Charge Control in the Bipolar Transistor;120
12.2;7.2. MOSFET Switching Characteristics;133
12.3;7.3. Problems;143
12.4;7.4. References;144
13;CHAPTER 8. Subnanosecond Switching Diodes;146
13.1;8.1. The Step-Recovery Diode;146
13.2;8.2. The Tunnel (Esaki) Diode;153
13.3;8.3. The Gunn Diode;162
13.4;8.4. References;166
14;CHAPTER 9. The Characteristics of High-Speed Logic;168
14.1;9.1. Transistor-Transistor Logic;169
14.2;9.2. Emitter-Coupled Logic;180
14.3;9.3. MOS Logic;186
14.4;9.4. Integrated Injection Logic;196
14.5;9.5. Charge-Coupled Devices;198
14.6;9.6. Trends;201
14.7;9.7. References;202
15;CHAPTER 10. The Implementation of High-Speed Systems;203
15.1;10.1. IC Packaging and Discrete Components;204
15.2;10.2. Printed Circuit Boards;206
15.3;10.3. The Distribution of Ground, Supplies and Signal Lines;208
15.4;10.4. Interconnections;209
15.5;10.5. Temperature Effects;218
15.6;10.6. References;219
16;APPENDIX 1: Additional References;221
17;APPENDIX 2: A Selection of Trigonometrical Functions, Integrals and Laplace Transforms;225
18;APPENDIX 3: Autocorrelation, Power Spectra and Random Signals;228
19;Index;230