Semiconductor Packaging

Materials Interaction and Reliability
1. Auflage 2011
ISBN: 978-1-4398-6205-6
Verlag: CRC Press

Buch, Englisch, 216 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 496 g

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package.

The book focuses on an important step in semiconductor manufacturing—package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability.

By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.

Zielgruppe

Electronic Materials (Materials Science, Physics, Chemical Engineers, Chemists), Electronics Engineers (especially focusing on ICs, solar, MEMS, and LED packaging)

Autoren/Hrsg.

Chen, Andrea

Lo, Randy Hsiao-Yu

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie

Inhaltsverzeichnis

SEMICONDUCTOR PACKAGES: History and Background. Package Form Factors and Families. Surface-Mount Technology. Other Packaging Needs. PACKAGE RELIABILITY: Reliability Testing. MATERIALS USED IN SEMICONDUCTOR PACKAGING: Polymers. Metals. Ceramics and Glasses. THE FUTURE: Trends and Challenges. Light-Emitting Diodes. Appendices. Index.

Über Autor(innen)

Andrea Chen is a technical marketing manager at Siliconware USA, Inc. She previously worked in the Technology Development group at ChipPAC, Inc. and in the Package Technology group at National Semiconductor Corporation. She has coauthored more than 30 papers and presentations.

Randy Hsiao-Yu Lo is president of Siliconware USA, Inc. He was previously the vice president of R&D at SPIL, leader of the Electronic Packaging Development group at ERSO/ITRI-Taiwan, and senior engineering manager of the Package Technology group at National Semiconductor Corporation. He has coauthored more than 20 papers and presentations and holds over 40 U.S. patents.