Design for Manufacturability

From 1D to 4D for 90-22 nm Technology Nodes
Softcover Nachdruck of the original 1. Auflage 2014
ISBN: 978-1-4939-4342-5
Verlag: Springer

Buch, Englisch, 278 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 4394 g

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

Zielgruppe

Professional/practitioner

Autoren/Hrsg.

Balasinski, Artur

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Schaltungsentwurf
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie

Inhaltsverzeichnis

Preface.- Classic DfM: from 2D to 3D.- DfM at 28 nm and Beyond.- New DfM Domain: Stress Effects.- Conclusions and Future Work.

Über Autor(innen)

Artur Balasinski is a Technology Design Integration Manager for Cypress Semiconductor in San Jose, California.